BZX384C18-HG3-08 footprint, schematic symbol and 3D model by Vishay

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BZX384C18-HG3-08 Details

The recommended land pattern for the BZX384C18-HG3-08 can be found in the Vishay Intertechnologies' application note 'Land Pattern Recommendations for Vishay Zener Diodes' (document number 28356).
The BZX384C18-HG3-08 has an ESD rating of 2 kV per human body model (HBM) and 150 V per machine model (MM). To ensure ESD protection, follow proper handling and storage procedures, and consider adding additional ESD protection devices in the circuit design.
The thermal resistance (RthJA) of the BZX384C18-HG3-08 is approximately 350 K/W. This value can be used to estimate the junction temperature of the device under different operating conditions.
The BZX384C18-HG3-08 is a commercial-grade component and may not meet the requirements for high-reliability or aerospace applications. For such applications, consider using a qualified component that meets the relevant industry standards, such as MIL-PRF-19500 or ESCC 5101/001.
The power rating of the BZX384C18-HG3-08 can be determined by considering the maximum power dissipation (Pd) and the thermal resistance (RthJA). The maximum power dissipation is 500 mW, and the thermal resistance is approximately 350 K/W. Use these values to calculate the maximum allowable current and voltage for the application.

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Use the download button to access the BZX384C18-HG3-08 schematic symbol, PCB footprint, and 3D model.

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