HALOGEN FREE AND ROHS COMPLIANT, PLASTIC PACKAGE-2
Country Of Origin:
Mainland China
ECCN Code:
EAR99
HTS Code:
8541.10.00.50
Factory Lead Time:
9 Weeks
Manufacturer:
Vishay Intertechnologies
YTEOL:
5.93
Additional Feature:
LOW NOISE
Case Connection:
ISOLATED
Configuration:
SINGLE
Diode Element Material:
SILICON
Diode Type:
ZENER DIODE
Dynamic Impedance-Max:
7 Ω
JEDEC-95 Code:
DO-35
JESD-30 Code:
O-PALF-W2
JESD-609 Code:
e2
Moisture Sensitivity Level:
1
Number of Elements:
1
Number of Terminals:
2
Operating Temperature-Max:
175 °C
Package Body Material:
PLASTIC/EPOXY
Package Shape:
ROUND
Package Style:
LONG FORM
Peak Reflow Temperature (Cel):
260
Polarity:
UNIDIRECTIONAL
Power Dissipation-Max:
0.5 W
Qualification Status:
Not Qualified
Reference Standard:
AEC-Q101
Reference Voltage-Nom:
8.2 V
Surface Mount:
NO
Technology:
ZENER
Terminal Finish:
Tin/Silver (Sn96.5Ag3.5)
Terminal Form:
WIRE
Terminal Position:
AXIAL
Time@Peak Reflow Temperature-Max (s):
30
Voltage Tol-Max:
6.1%
Working Test Current:
5 mA
BZX55C8V2-TAP Frequently Asked Questions (FAQs)
The recommended land pattern for the BZX55C8V2-TAP is a rectangular pad with a size of 1.3 mm x 0.8 mm, with a solder mask clearance of 0.2 mm.
Yes, the BZX55C8V2-TAP is rated for operation up to 150°C, making it suitable for high-temperature applications. However, the device's electrical characteristics may degrade at higher temperatures.
Handle the BZX55C8V2-TAP by the body, avoiding touching the glass passivation layer or the metal pads. Use anti-static precautions and avoid bending or flexing the leads.
Yes, the BZX55C8V2-TAP is suitable for high-frequency applications due to its low capacitance and inductance. However, the device's performance may degrade at very high frequencies (>1 GHz).
The recommended soldering profile for the BZX55C8V2-TAP is a peak temperature of 260°C, with a dwell time of 10-30 seconds. Avoid exceeding 280°C to prevent damage to the device.
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BZX55C8V2-TAP Overview
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