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BZX584C3V3-G3-08 - Vishay

Description: Zener Diodes 300mW SOD-523 3.3V Small Signal

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PCB Footprints
BZX584C3V3-G3-08 - Vishay PCB footprint - Small Outline Diode Flat Lead - Small Outline Diode Flat Lead - sod-523
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BZX584C3V3-G3-08 - Vishay  - 3D model - Small Outline Diode Flat Lead - sod-523
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BZX584C3V3-G3-08 Details

  • Manufacturer Part Number:

    BZX584C3V3-G3-08

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SOD-523, 2 PIN

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Factory Lead Time:

    8 Weeks

  • Date Of Intro:

    2019-10-11

  • Manufacturer:

    Vishay Intertechnologies

  • YTEOL:

    7.1

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    ZENER DIODE

  • Dynamic Impedance-Max:

    85 Ω

  • JESD-30 Code:

    R-PDSO-F2

  • JESD-609 Code:

    e3

  • Knee Impedance-Max:

    350 Ω

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    UNIDIRECTIONAL

  • Power Dissipation-Max:

    0.2 W

  • Reference Voltage-Nom:

    3.3 V

  • Reverse Current-Max:

    5 µA

  • Reverse Test Voltage:

    1 V

  • Surface Mount:

    YES

  • Technology:

    ZENER

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Voltage Temp Coeff-Max:

    -0.3 mV/°C

  • Voltage Tol-Max:

    5%

  • Working Test Current:

    5 mA

BZX584C3V3-G3-08 Frequently Asked Questions (FAQs)

  • The recommended soldering temperature for the BZX584C3V3-G3-08 is 260°C for 10 seconds, with a peak temperature of 240°C.
  • Yes, the BZX584C3V3-G3-08 is RoHS (Restriction of Hazardous Substances) compliant, meaning it does not contain hazardous substances like lead, mercury, and cadmium.
  • The maximum power dissipation of the BZX584C3V3-G3-08 is 500 mW.
  • Yes, the BZX584C3V3-G3-08 is suitable for high-reliability applications, such as aerospace, defense, and medical devices, due to its high-quality construction and rigorous testing.
  • Yes, the BZX584C3V3-G3-08 is compatible with lead-free soldering processes, making it suitable for use in modern electronic assemblies.

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BZX584C3V3-G3-08 Overview

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