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BZX58550-C1V8X - Nexperia

Description: NEXPERIA - BZX58550-C1V8X - Zener Single Diode, 1.8 V, 300 mW, SC-79, 2 Pins, 150 °C, Surface Mount

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BZX58550-C1V8X - Nexperia PCB footprint - Other - Other - BZX58550-C1V8X-5
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BZX58550-C1V8X Details

  • Manufacturer Part Number:

    BZX58550-C1V8X

  • Brand Name:

    Nexperia

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOD

  • Package Description:

    SC-79, SOD-523, 2 PIN

  • Pin Count:

    2

  • Manufacturer Package Code:

    SOD523

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Nexperia

  • YTEOL:

    6.95

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    ZENER DIODE

  • Dynamic Impedance-Max:

    100 Ω

  • JESD-30 Code:

    R-PDSO-F2

  • Knee Impedance-Max:

    600 Ω

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    UNIDIRECTIONAL

  • Power Dissipation-Max:

    0.3 W

  • Reference Standard:

    IEC-60134

  • Reference Voltage-Nom:

    1.8 V

  • Reverse Current-Max:

    7.5 µA

  • Reverse Test Voltage:

    1 V

  • Surface Mount:

    YES

  • Technology:

    ZENER

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Voltage Tol-Max:

    5%

  • Working Test Current:

    0.05 mA

BZX58550-C1V8X Frequently Asked Questions (FAQs)

  • The recommended land pattern for the BZX58550-C1V8X is a rectangular pad with a size of 1.3 mm x 0.8 mm, with a solder mask clearance of 0.1 mm. The pad should be centered on the component.
  • The BZX58550-C1V8X has a thermal resistance of 25 K/W. To handle thermal considerations, ensure good thermal conduction by using a thermal pad or a heat sink, and avoid overheating by keeping the junction temperature below 150°C.
  • The recommended soldering profile for the BZX58550-C1V8X is a peak temperature of 260°C, with a dwell time of 30-60 seconds above 217°C. The soldering process should be done in a nitrogen atmosphere to prevent oxidation.
  • Yes, the BZX58550-C1V8X is suitable for high-reliability applications. It is manufactured using a high-reliability process and is qualified to AEC-Q101 standards. However, it is recommended to perform additional testing and validation for specific high-reliability requirements.
  • To ensure the BZX58550-C1V8X is properly biased during operation, ensure that the voltage across the device is within the recommended operating range of 1.8V to 5.5V, and that the current is within the recommended operating range of 1mA to 100mA.

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BZX58550-C1V8X Overview

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About Nexperia

Nexperia is a leading global player in the semiconductor industry. Specializing in essential electronic components, Nexperia offers a diverse range of products including discrete components, MOSFETs, logic ICs, and analog ICs. These components are integral to a multitude of applications across automotive, industrial, consumer electronics, and computing sectors, where reliability, performance, and efficiency are paramount.

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