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BZX79-C10,113 - Nexperia

Description: Zener Diodes DIODE ZENER 5 PCT

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PCB Footprints
BZX79-C10,113 - Nexperia PCB footprint - Diodes, Axial Diameter Horizontal Mounting - Diodes, Axial Diameter Horizontal Mounting - SOD27
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3D Models
BZX79-C10,113 - Nexperia  - 3D model - Diodes, Axial Diameter Horizontal Mounting - SOD27
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BZX79-C10,113 Details

  • Manufacturer Part Number:

    BZX79-C10,113

  • Brand Name:

    Nexperia

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    AXIAL

  • Package Description:

    SC-40, SOD-27, 2 PIN

  • Pin Count:

    2

  • Manufacturer Package Code:

    SOD27

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Factory Lead Time:

    8 Weeks

  • Manufacturer:

    Nexperia

  • YTEOL:

    5.93

  • Case Connection:

    ISOLATED

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    ZENER DIODE

  • Dynamic Impedance-Max:

    20 Ω

  • JEDEC-95 Code:

    DO-35

  • JESD-30 Code:

    O-LALF-W2

  • JESD-609 Code:

    e3

  • Knee Impedance-Max:

    150 Ω

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    200 °C

  • Operating Temperature-Min:

    -65 °C

  • Package Body Material:

    GLASS

  • Package Shape:

    ROUND

  • Package Style:

    LONG FORM

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    UNIDIRECTIONAL

  • Power Dissipation-Max:

    0.5 W

  • Reference Standard:

    IEC-60134

  • Reference Voltage-Nom:

    10 V

  • Reverse Current-Max:

    0.2 µA

  • Reverse Test Voltage:

    7 V

  • Surface Mount:

    NO

  • Technology:

    ZENER

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    WIRE

  • Terminal Position:

    AXIAL

  • Time@Peak Reflow Temperature-Max (s):

    10

  • Voltage Temp Coeff-Max:

    8 mV/°C

  • Voltage Tol-Max:

    5%

  • Working Test Current:

    5 mA

BZX79-C10,113 Frequently Asked Questions (FAQs)

  • The recommended land pattern for the BZX79-C10,113 is a rectangular pad with a size of 1.3 mm x 0.8 mm, with a solder mask opening of 0.5 mm x 0.5 mm. The pad should be centered on the component and have a non-solder mask defined (NSMD) pad shape.
  • The BZX79-C10,113 has a thermal resistance of 300 K/W. To handle thermal considerations, ensure good thermal conduction by using a thermal pad or a heat sink, and keep the component away from heat sources. Also, ensure good airflow around the component to prevent overheating.
  • The recommended soldering profile for the BZX79-C10,113 is a peak temperature of 260°C, with a dwell time of 30-60 seconds above 220°C. The soldering process should be done in a nitrogen atmosphere to prevent oxidation.
  • Yes, the BZX79-C10,113 is suitable for high-reliability applications. It is manufactured using a high-reliability process and has undergone rigorous testing to ensure its quality and reliability. However, it is recommended to follow the recommended storage and handling procedures to prevent damage.
  • After soldering, ensure the BZX79-C10,113 is properly cleaned and dried to prevent moisture damage. Use a mild detergent and deionized water to clean the component, and dry it with a soft brush or air blower. Avoid using ultrasonic cleaning or high-pressure washing.

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BZX79-C10,113 Overview

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About Nexperia

Nexperia is a leading global player in the semiconductor industry. Specializing in essential electronic components, Nexperia offers a diverse range of products including discrete components, MOSFETs, logic ICs, and analog ICs. These components are integral to a multitude of applications across automotive, industrial, consumer electronics, and computing sectors, where reliability, performance, and efficiency are paramount.

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Part Image 933117790133 NXP Semiconductors

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