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BZX84-A4V3,215 - Nexperia

Description: Zener Diode 4.3 V 250 mW ±1% Surface Mount TO-236AB

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PCB Footprints
BZX84-A4V3,215 - Nexperia PCB footprint - SOT23 (3-Pin) - SOT23 (3-Pin) - SOT23  (TO-236AB)
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BZX84-A4V3,215 - Nexperia  - 3D model - SOT23 (3-Pin) - SOT23  (TO-236AB)
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BZX84-A4V3,215 Details

  • Manufacturer Part Number:

    BZX84-A4V3,215

  • Brand Name:

    Nexperia

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TO-236

  • Package Description:

    SOT-23, 3 PIN

  • Pin Count:

    3

  • Manufacturer Package Code:

    SOT23

  • Country Of Origin:

    Mainland China, Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Factory Lead Time:

    8 Weeks

  • Date Of Intro:

    1999-05-18

  • Manufacturer:

    Nexperia

  • YTEOL:

    7

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    ZENER DIODE

  • Dynamic Impedance-Max:

    90 Ω

  • JEDEC-95 Code:

    TO-236AB

  • JESD-30 Code:

    R-PDSO-G3

  • JESD-609 Code:

    e3

  • Knee Impedance-Max:

    600 Ω

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    UNIDIRECTIONAL

  • Power Dissipation-Max:

    0.25 W

  • Reference Standard:

    IEC-60134

  • Reference Voltage-Nom:

    4.3 V

  • Reverse Current-Max:

    3 µA

  • Reverse Test Voltage:

    1 V

  • Surface Mount:

    YES

  • Technology:

    ZENER

  • Terminal Finish:

    TIN

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Voltage Tol-Max:

    1%

  • Working Test Current:

    5 mA

BZX84-A4V3,215 Frequently Asked Questions (FAQs)

  • The recommended land pattern for the BZX84-A4V3,215 is a rectangular pad with a size of 0.8 mm x 1.2 mm, with a solder mask opening of 0.6 mm x 0.8 mm.
  • To handle thermal considerations, ensure a good thermal connection to a copper plane or a thermal pad on the PCB. A thermal via or a thermal pad with a diameter of at least 1 mm is recommended.
  • The maximum allowable power dissipation for the BZX84-A4V3,215 is 250 mW. However, this value can be derated based on the ambient temperature and the thermal resistance of the PCB.
  • Yes, the BZX84-A4V3,215 is suitable for high-reliability applications. It is manufactured using a high-reliability process and is qualified according to the AEC-Q101 standard.
  • To ensure proper soldering, use a soldering profile with a peak temperature of 260°C and a dwell time of 30-60 seconds. Avoid overheating the component, and ensure the solder joints are clean and free of oxidation.

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BZX84-A4V3,215 Overview

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About Nexperia

Nexperia is a leading global player in the semiconductor industry. Specializing in essential electronic components, Nexperia offers a diverse range of products including discrete components, MOSFETs, logic ICs, and analog ICs. These components are integral to a multitude of applications across automotive, industrial, consumer electronics, and computing sectors, where reliability, performance, and efficiency are paramount.

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Part Image BZX84A4V3 YAGEO Corporation

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