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BZX84-B10,215 - Nexperia

Description: Zener Diode 10 V 250 mW ±2% Surface Mount TO-236AB

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PCB Footprints
BZX84-B10,215 - Nexperia PCB footprint - SOT23 (3-Pin) - SOT23 (3-Pin) - SOT23-2024
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3D Models
BZX84-B10,215 - Nexperia  - 3D model - SOT23 (3-Pin) - SOT23-2024
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BZX84-B10,215 Details

  • Manufacturer Part Number:

    BZX84-B10,215

  • Brand Name:

    Nexperia

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TO-236

  • Package Description:

    SOT-23, 3 PIN

  • Pin Count:

    3

  • Manufacturer Package Code:

    SOT23

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Factory Lead Time:

    8 Weeks

  • Date Of Intro:

    1999-05-18

  • Manufacturer:

    Nexperia

  • YTEOL:

    7

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    ZENER DIODE

  • Dynamic Impedance-Max:

    20 Ω

  • JEDEC-95 Code:

    TO-236AB

  • JESD-30 Code:

    R-PDSO-G3

  • JESD-609 Code:

    e3

  • Knee Impedance-Max:

    150 Ω

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    UNIDIRECTIONAL

  • Power Dissipation-Max:

    0.25 W

  • Reference Standard:

    IEC-60134

  • Reference Voltage-Nom:

    10 V

  • Reverse Current-Max:

    0.2 µA

  • Reverse Test Voltage:

    7 V

  • Surface Mount:

    YES

  • Technology:

    ZENER

  • Terminal Finish:

    TIN

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Voltage Temp Coeff-Max:

    8 mV/°C

  • Voltage Tol-Max:

    2%

  • Working Test Current:

    5 mA

BZX84-B10,215 Frequently Asked Questions (FAQs)

  • The recommended land pattern for the BZX84-B10,215 is a rectangular pad with a size of 1.3 mm x 0.6 mm, with a solder mask clearance of 0.1 mm.
  • To handle thermal considerations, ensure a good thermal connection to a copper plane or a thermal pad on the PCB. The thermal resistance of the device is 300 K/W, and the maximum power dissipation is 500 mW.
  • The recommended soldering profile for the BZX84-B10,215 is a peak temperature of 260°C, with a dwell time of 30-60 seconds above 217°C. The device is compatible with lead-free soldering processes.
  • Yes, the BZX84-B10,215 is suitable for high-reliability applications. It is manufactured using a high-reliability process, and it has undergone rigorous testing to ensure its quality and reliability.
  • To ensure the BZX84-B10,215 is properly biased, connect the anode to a stable voltage source, and the cathode to the circuit being regulated. Ensure the voltage across the device is within the recommended operating range.

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BZX84-B10,215 Overview

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About Nexperia

Nexperia is a leading global player in the semiconductor industry. Specializing in essential electronic components, Nexperia offers a diverse range of products including discrete components, MOSFETs, logic ICs, and analog ICs. These components are integral to a multitude of applications across automotive, industrial, consumer electronics, and computing sectors, where reliability, performance, and efficiency are paramount.

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Part Image BZX84-B10-Q Nexperia

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Part Image BZX84-B10,215 NXP Semiconductors

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Part Image BZX84-B10/T3 NXP Semiconductors

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Part Image BZX84-B10T/R NXP Semiconductors

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