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BZX84-B13,215 - Nexperia

Description: Zener Diodes ZENER SOT-23 .25W 13V

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PCB Footprints
BZX84-B13,215 - Nexperia PCB footprint - SOT23 (3-Pin) - SOT23 (3-Pin) - -SOT23 (TO-236AB)
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3D Models
BZX84-B13,215 - Nexperia  - 3D model - SOT23 (3-Pin) - -SOT23 (TO-236AB)
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BZX84-B13,215 Details

  • Manufacturer Part Number:

    BZX84-B13,215

  • Brand Name:

    Nexperia

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TO-236

  • Package Description:

    SOT-23, 3 PIN

  • Pin Count:

    3

  • Manufacturer Package Code:

    SOT23

  • Country Of Origin:

    Mainland China, Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Factory Lead Time:

    8 Weeks

  • Date Of Intro:

    1999-05-18

  • Manufacturer:

    Nexperia

  • YTEOL:

    7

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    ZENER DIODE

  • Dynamic Impedance-Max:

    30 Ω

  • JEDEC-95 Code:

    TO-236AB

  • JESD-30 Code:

    R-PDSO-G3

  • JESD-609 Code:

    e3

  • Knee Impedance-Max:

    170 Ω

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    UNIDIRECTIONAL

  • Power Dissipation-Max:

    0.25 W

  • Reference Standard:

    IEC-60134

  • Reference Voltage-Nom:

    13 V

  • Reverse Current-Max:

    0.1 µA

  • Reverse Test Voltage:

    8 V

  • Surface Mount:

    YES

  • Technology:

    ZENER

  • Terminal Finish:

    TIN

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Voltage Temp Coeff-Max:

    11 mV/°C

  • Voltage Tol-Max:

    2%

  • Working Test Current:

    5 mA

BZX84-B13,215 Frequently Asked Questions (FAQs)

  • The recommended land pattern for the BZX84-B13,215 is a rectangular pad with a size of 0.8 mm x 1.6 mm, with a solder mask clearance of 0.2 mm.
  • To handle thermal considerations, ensure a good thermal connection to a copper plane or a thermal pad on the PCB. The thermal resistance of the device is 250 K/W, and the maximum power dissipation is 500 mW.
  • The recommended soldering profile for the BZX84-B13,215 is a peak temperature of 260°C, with a dwell time of 30-60 seconds above 217°C. The device is compatible with lead-free soldering processes.
  • To ensure reliability, operate the device within the recommended operating temperature range of -65°C to 150°C. Avoid exceeding the maximum junction temperature of 150°C, and ensure proper thermal management to prevent overheating.
  • The BZX84-B13,215 has an integrated ESD protection diode, but additional external ESD protection measures may be necessary depending on the application. Follow proper ESD handling and storage procedures to prevent damage.

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BZX84-B13,215 Overview

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About Nexperia

Nexperia is a leading global player in the semiconductor industry. Specializing in essential electronic components, Nexperia offers a diverse range of products including discrete components, MOSFETs, logic ICs, and analog ICs. These components are integral to a multitude of applications across automotive, industrial, consumer electronics, and computing sectors, where reliability, performance, and efficiency are paramount.

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