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BZX8450-C1V8R - Nexperia

Description: Zener Diodes BZX8450-C1V8/SOT23/TO-236AB

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PCB Footprints
BZX8450-C1V8R - Nexperia PCB footprint - SOT23 (3-Pin) - SOT23 (3-Pin) - Package outline TO-236AB (SOT23)
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BZX8450-C1V8R - Nexperia  - 3D model - SOT23 (3-Pin) - Package outline TO-236AB (SOT23)
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BZX8450-C1V8R Details

  • Manufacturer Part Number:

    BZX8450-C1V8R

  • Brand Name:

    Nexperia

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TO-236

  • Package Description:

    SOT-23, 3 PIN

  • Pin Count:

    3

  • Manufacturer Package Code:

    SOT23

  • Country Of Origin:

    Mainland China, Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Factory Lead Time:

    8 Weeks

  • Manufacturer:

    Nexperia

  • YTEOL:

    7

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    ZENER DIODE

  • Dynamic Impedance-Max:

    100 Ω

  • JEDEC-95 Code:

    TO-236AB

  • JESD-30 Code:

    R-PDSO-G3

  • Knee Impedance-Max:

    600 Ω

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    UNIDIRECTIONAL

  • Power Dissipation-Max:

    0.25 W

  • Reference Standard:

    IEC-60134

  • Reference Voltage-Nom:

    1.8 V

  • Reverse Current-Max:

    7.5 µA

  • Reverse Test Voltage:

    1 V

  • Surface Mount:

    YES

  • Technology:

    ZENER

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Voltage Tol-Max:

    5%

  • Working Test Current:

    0.05 mA

BZX8450-C1V8R Frequently Asked Questions (FAQs)

  • The recommended land pattern for the BZX8450-C1V8R can be found in the Nexperia SOT23 standard footprint document, which provides guidelines for PCB layout and pad dimensions.
  • To ensure proper soldering, follow the recommended soldering profile and temperature guidelines provided in the Nexperia SOT23 soldering guide. Additionally, use a solder with a melting point below 260°C to prevent damage to the device.
  • The maximum power dissipation of the BZX8450-C1V8R is dependent on the ambient temperature and the thermal resistance of the PCB. As a general guideline, the maximum power dissipation is 250 mW at an ambient temperature of 70°C. However, it's recommended to consult the thermal derating curve in the datasheet to determine the maximum power dissipation for a specific application.
  • Yes, the BZX8450-C1V8R is qualified according to the AEC-Q101 standard, which makes it suitable for use in automotive and high-reliability applications. However, it's recommended to consult the Nexperia quality and reliability documentation to ensure the device meets the specific requirements of the application.
  • The BZX8450-C1V8R is sensitive to electrostatic discharge (ESD) and moisture. To prevent damage, it's recommended to store the devices in their original packaging or in a shielded container, and to follow the guidelines for ESD handling and moisture sensitivity level (MSL) provided in the Nexperia documentation.

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BZX8450-C1V8R Overview

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About Nexperia

Nexperia is a leading global player in the semiconductor industry. Specializing in essential electronic components, Nexperia offers a diverse range of products including discrete components, MOSFETs, logic ICs, and analog ICs. These components are integral to a multitude of applications across automotive, industrial, consumer electronics, and computing sectors, where reliability, performance, and efficiency are paramount.

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