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BZX84B13VLFHT116 - ROHM Semiconductor

Description: Zener Diode 13 V 250 mW ±2.31% Surface Mount SSD3 ,250 mW,100 nA @ 8 V,30 Ohms

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BZX84B13VLFHT116 - ROHM Semiconductor PCB footprint - Other - Other - SSD3_2025-2
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BZX84B13VLFHT116 - ROHM Semiconductor  - 3D model - Other - SSD3_2025-2
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BZX84B13VLFHT116 Details

  • Manufacturer Part Number:

    BZX84B13VLFHT116

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Not Recommended

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Date Of Intro:

    2017-09-07

  • Manufacturer:

    ROHM Semiconductor

  • YTEOL:

    3

  • Additional Feature:

    HIGH RELIABILITY

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    ZENER DIODE

  • Dynamic Impedance-Max:

    30 Ω

  • JESD-30 Code:

    R-PDSO-G3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    UNIDIRECTIONAL

  • Power Dissipation-Max:

    0.25 W

  • Reference Standard:

    AEC-Q101

  • Reference Voltage-Nom:

    13 V

  • Reverse Current-Max:

    0.1 µA

  • Reverse Test Voltage:

    8 V

  • Surface Mount:

    YES

  • Technology:

    ZENER

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Voltage Temp Coeff-Max:

    11 mV/°C

  • Voltage Tol-Max:

    2.31%

  • Working Test Current:

    5 mA

BZX84B13VLFHT116 Frequently Asked Questions (FAQs)

  • The recommended land pattern for the BZX84B13VLFHT116 can be found in the ROHM Semiconductor's package drawing document, which is usually available on their website. The document provides detailed information on the recommended pad layout, dimensions, and spacing for optimal assembly and reliability.
  • The BZX84B13VLFHT116 is an ESD-sensitive device, and proper handling and storage procedures should be followed to prevent damage. This includes using anti-static wrist straps, mats, and bags, as well as avoiding direct contact with the device's pins. Additionally, the device should be stored in a dry, cool place away from direct sunlight.
  • The maximum power dissipation of the BZX84B13VLFHT116 is dependent on the operating conditions, such as ambient temperature and thermal resistance. According to the datasheet, the maximum power dissipation is 500mW. However, it's recommended to derate the power dissipation based on the actual operating conditions to ensure reliable operation.
  • The BZX84B13VLFHT116 is rated for operation up to 150°C, but the device's performance and reliability may degrade at high temperatures. It's recommended to consult the datasheet and ROHM Semiconductor's application notes for guidance on using the device in high-temperature environments.
  • To ensure proper soldering of the BZX84B13VLFHT116, follow the recommended soldering profile and procedures outlined in the ROHM Semiconductor's application notes and datasheet. This includes using a soldering iron with a temperature range of 250-260°C, and avoiding excessive soldering time or temperature.

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