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BZX84C15-TP - MCC

Description: Zener Diode 15 V 350 mW ±5% Surface Mount SOT-23

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PCB Footprints
BZX84C15-TP - MCC PCB footprint - SOT23 (3-Pin) - SOT23 (3-Pin) - SOT-23-ren20
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3D Models
BZX84C15-TP - MCC  - 3D model - SOT23 (3-Pin) - SOT-23-ren20
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BZX84C15-TP Details

  • Manufacturer Part Number:

    BZX84C15-TP

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    PACKAGE-3

  • Pin Count:

    3

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Manufacturer:

    Micro Commercial Components

  • YTEOL:

    6.7

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    ZENER DIODE

  • Dynamic Impedance-Max:

    30 Ω

  • Forward Voltage-Max (VF):

    0.9 V

  • JESD-30 Code:

    R-PDSO-G3

  • JESD-609 Code:

    e3

  • Knee Impedance-Max:

    200 Ω

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    UNIDIRECTIONAL

  • Power Dissipation-Max:

    0.35 W

  • Qualification Status:

    Not Qualified

  • Reference Voltage-Nom:

    15 V

  • Reverse Current-Max:

    0.1 µA

  • Reverse Test Voltage:

    10.5 V

  • Surface Mount:

    YES

  • Technology:

    ZENER

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    10

  • Voltage Tol-Max:

    5%

  • Working Test Current:

    5 mA

BZX84C15-TP Frequently Asked Questions (FAQs)

  • The recommended land pattern for the BZX84C15-TP is a rectangular pad with a size of 1.3mm x 0.8mm, with a solder mask clearance of 0.1mm around the pad.
  • The BZX84C15-TP is rated for operation up to 150°C, but it's recommended to derate the voltage and current ratings at higher temperatures to ensure reliability and prevent thermal runaway.
  • To prevent damage during soldering, use a soldering iron with a temperature of 250°C or less, and avoid applying excessive force or pressure to the component. Also, ensure that the soldering time is limited to 3 seconds or less.
  • Yes, the BZX84C15-TP is compatible with lead-free soldering processes, but it's recommended to follow the manufacturer's guidelines for lead-free soldering to ensure reliable assembly.
  • The recommended storage condition for the BZX84C15-TP is in a dry, cool place with a temperature range of 5°C to 30°C and humidity below 60%.

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BZX84C15-TP Overview

Use the download button to access the BZX84C15-TP schematic symbol, PCB footprint, and 3D model.
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