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BZX84C30 - Diodes Incorporated

Description: 350mW SURFACE MOUNT ZENER DIODE

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PCB Footprints
BZX84C30 - Diodes Incorporated PCB footprint - Other - Other - SOT91P240X110-3N
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3D Models
BZX84C30 - Diodes Incorporated  - 3D model - Other - SOT91P240X110-3N
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BZX84C30 Details

  • Manufacturer Part Number:

    BZX84C30

  • Pbfree Code:

    No

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SOT-23

  • Package Description:

    SOT-23, 3 PIN

  • Pin Count:

    3

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Manufacturer:

    Diodes Incorporated

  • YTEOL:

    0

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    ZENER DIODE

  • Dynamic Impedance-Max:

    80 Ω

  • JESD-30 Code:

    R-PDSO-G3

  • JESD-609 Code:

    e0

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    235

  • Polarity:

    UNIDIRECTIONAL

  • Power Dissipation-Max:

    0.33 W

  • Qualification Status:

    Not Qualified

  • Reference Voltage-Nom:

    30 V

  • Surface Mount:

    YES

  • Technology:

    ZENER

  • Terminal Finish:

    Tin/Lead (Sn/Pb)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    10

  • Voltage Tol-Max:

    5%

  • Working Test Current:

    2 mA

BZX84C30 Frequently Asked Questions (FAQs)

  • The recommended land pattern for the BZX84C30 can be found in the Diodes Incorporated's SOT23 package layout guidelines, which can be downloaded from their website. The guidelines provide detailed information on the recommended pad size, spacing, and layout to ensure reliable assembly and performance.
  • While the BZX84C30 is rated for operation up to 150°C, it's essential to consider the derating curves and thermal resistance (RθJA) to ensure the device doesn't exceed its maximum junction temperature. Additionally, the device's reliability and lifespan may be affected by prolonged exposure to high temperatures. Consult with a thermal expert or Diodes Incorporated's application support team for guidance.
  • The BZX84C30 is a sensitive device and requires proper ESD protection during handling, storage, and assembly. Follow standard ESD precautions, such as using an ESD wrist strap, mat, or workstation, and ensure that all equipment and tools are properly grounded. Additionally, consider using ESD-protective packaging and storage materials.
  • While the BZX84C30 is primarily designed for low-frequency applications, it can be used in high-frequency circuits with proper consideration. The device's parasitic capacitance and inductance can affect its performance at high frequencies. Consult with a high-frequency design expert or Diodes Incorporated's application support team to determine the suitability of the BZX84C30 for your specific application.
  • The recommended soldering profile for the BZX84C30 can be found in the Diodes Incorporated's SOT23 package soldering guidelines, which can be downloaded from their website. The guidelines provide detailed information on the recommended soldering temperature, time, and profile to ensure reliable assembly and minimize the risk of damage.

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BZX84C30 Overview

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