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BZX84C3V9LT1G - onsemi

Description: 250 mW Rating on FR-4 or FR-5 Board; Zener Breakdown Voltage Range - 2.4 V to 75 V; Package Designed for Optimal Automated Board Assembly; Small Package Size for High Density Applications; ESD Rating of Class 3 (>16 KV) per Human Body Model; Mechanical Characteristics:; CASE: Void-free, transfer-molded, thermosetting plastic case; FINISH: Corrosion resistant finish, easily solderable; MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 260°C for 10 Seconds; POLARITY: Cathode indicated by polarity band; FLAMMAB

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PCB Footprints
BZX84C3V9LT1G - onsemi PCB footprint - SOT23 (3-Pin) - SOT23 (3-Pin) - SOT-23 (TO-236) CASE 318-08 ISSUE AS
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3D Models
BZX84C3V9LT1G - onsemi  - 3D model - SOT23 (3-Pin) - SOT-23 (TO-236) CASE 318-08 ISSUE AS
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BZX84C3V9LT1G Details

  • Manufacturer Part Number:

    BZX84C3V9LT1G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOT-23 (TO-236) 3 LEAD

  • Pin Count:

    3

  • Manufacturer Package Code:

    318

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Manufacturer:

    onsemi

  • YTEOL:

    7.1

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    ZENER DIODE

  • Dynamic Impedance-Max:

    90 Ω

  • JEDEC-95 Code:

    TO-236AB

  • JESD-30 Code:

    R-PDSO-G3

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -65 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    UNIDIRECTIONAL

  • Power Dissipation-Max:

    0.25 W

  • Qualification Status:

    Not Qualified

  • Reference Standard:

    UL RECOGNIZED

  • Reference Voltage-Nom:

    3.9 V

  • Surface Mount:

    YES

  • Technology:

    ZENER

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Voltage Tol-Max:

    5.13%

  • Working Test Current:

    5 mA

BZX84C3V9LT1G Frequently Asked Questions (FAQs)

  • The recommended land pattern for the BZX84C3V9LT1G is a rectangular pad with a size of 0.76 mm x 0.76 mm, with a solder mask clearance of 0.15 mm.
  • To handle the ESD sensitivity of the BZX84C3V9LT1G, it is recommended to use ESD protection devices, such as TVS diodes, and follow proper handling and storage procedures to prevent damage from electrostatic discharge.
  • The maximum operating temperature range for the BZX84C3V9LT1G is -65°C to 150°C, but the recommended operating temperature range is -40°C to 125°C for optimal performance and reliability.
  • Yes, the BZX84C3V9LT1G is suitable for high-reliability applications, such as aerospace, automotive, and industrial control systems, due to its high-quality manufacturing process and rigorous testing procedures.
  • To ensure the BZX84C3V9LT1G is properly soldered, follow the recommended soldering profile, use a solder with a melting point below 260°C, and avoid excessive soldering temperatures and times to prevent damage to the device.

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BZX84C3V9LT1G Overview

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Part Image BZX84-C3V9T/R NXP Semiconductors

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For a full list of alternate parts for BZX84C3V9LT1G, check out Findchips.com