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BZX884-B20,315 - Nexperia

Description: Zener Diode 20 V 250 mW ±2% Surface Mount DFN1006-2

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BZX884-B20,315 - Nexperia PCB footprint - Other - Other - BZX884-B20,315-2
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BZX884-B20,315 - Nexperia  - 3D model - Other - BZX884-B20,315-2
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BZX884-B20,315 Details

  • Manufacturer Part Number:

    BZX884-B20,315

  • Brand Name:

    Nexperia

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    DFN

  • Package Description:

    SOD-882, DFN1006-2, 2 PIN

  • Pin Count:

    2

  • Manufacturer Package Code:

    SOD882

  • Country Of Origin:

    Mainland China, Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Factory Lead Time:

    8 Weeks

  • Manufacturer:

    Nexperia

  • YTEOL:

    7

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    ZENER DIODE

  • Dynamic Impedance-Max:

    55 Ω

  • JESD-30 Code:

    R-PBCC-N2

  • JESD-609 Code:

    e3

  • Knee Impedance-Max:

    225 Ω

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    CHIP CARRIER

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    UNIDIRECTIONAL

  • Power Dissipation-Max:

    0.25 W

  • Qualification Status:

    Not Qualified

  • Reference Standard:

    IEC-60134

  • Reference Voltage-Nom:

    20 V

  • Reverse Current-Max:

    0.05 µA

  • Reverse Test Voltage:

    14 V

  • Surface Mount:

    YES

  • Technology:

    ZENER

  • Terminal Finish:

    TIN

  • Terminal Form:

    NO LEAD

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Voltage Temp Coeff-Max:

    16.4 mV/°C

  • Voltage Tol-Max:

    2%

  • Working Test Current:

    5 mA

BZX884-B20,315 Frequently Asked Questions (FAQs)

  • The recommended land pattern for the BZX884-B20,315 is a rectangular pad with a size of 1.3 mm x 0.8 mm, with a solder mask opening of 0.5 mm x 0.5 mm. The pad should be centered on the component and have a non-solder mask defined (NSMD) pad shape.
  • To handle thermal considerations, ensure good thermal conductivity between the device and the PCB by using a thermal via or a thermal pad. Also, keep the device away from heat sources and ensure good airflow around the device.
  • The maximum power dissipation for the BZX884-B20,315 is 500 mW. However, this value can be derated based on the ambient temperature and the thermal resistance of the device.
  • Yes, the BZX884-B20,315 is suitable for high-reliability applications. It is manufactured using a high-reliability process and is qualified according to the AEC-Q101 standard for automotive applications.
  • To ensure proper soldering, use a soldering iron with a temperature of 250°C to 260°C, and apply a solder paste with a melting point of 217°C to 221°C. Also, ensure the component is properly aligned and the solder joints are visually inspected.

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BZX884-B20,315 Overview

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About Nexperia

Nexperia is a leading global player in the semiconductor industry. Specializing in essential electronic components, Nexperia offers a diverse range of products including discrete components, MOSFETs, logic ICs, and analog ICs. These components are integral to a multitude of applications across automotive, industrial, consumer electronics, and computing sectors, where reliability, performance, and efficiency are paramount.

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