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BZX884-B4V7,315 - Nexperia

Description: NXP, 4.7V Zener Diode 2% 250 mW SMT 2-Pin SOD-882

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BZX884-B4V7,315 - Nexperia - PCB symbol
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PCB Footprints
BZX884-B4V7,315 - Nexperia PCB footprint - Other - Other - SOD882
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3D Models
BZX884-B4V7,315 - Nexperia - 3D model - Other - SOD882
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BZX884-B4V7,315 Details

  • Manufacturer Part Number:

    BZX884-B4V7,315

  • Brand Name:

    Nexperia

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    DFN

  • Package Description:

    SOD-882, DFN1006-2, 2 PIN

  • Pin Count:

    2

  • Manufacturer Package Code:

    SOD882

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Factory Lead Time:

    8 Weeks

  • Manufacturer:

    Nexperia

  • YTEOL:

    7.37

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    ZENER DIODE

  • Dynamic Impedance-Max:

    80 Ω

  • JESD-30 Code:

    R-PBCC-N2

  • JESD-609 Code:

    e3

  • Knee Impedance-Max:

    500 Ω

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    CHIP CARRIER

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    UNIDIRECTIONAL

  • Power Dissipation-Max:

    0.25 W

  • Qualification Status:

    Not Qualified

  • Reference Standard:

    IEC-60134

  • Reference Voltage-Nom:

    4.7 V

  • Reverse Current-Max:

    3 µA

  • Reverse Test Voltage:

    2 V

  • Surface Mount:

    YES

  • Technology:

    ZENER

  • Terminal Finish:

    TIN

  • Terminal Form:

    NO LEAD

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Voltage Temp Coeff-Max:

    -1.2 mV/°C

  • Voltage Tol-Max:

    2%

  • Working Test Current:

    5 mA

BZX884-B4V7,315 Frequently Asked Questions (FAQs)

  • The recommended land pattern for the BZX884-B4V7,315 is a rectangular pad with a size of 0.8 mm x 1.2 mm, with a solder mask opening of 0.6 mm x 0.8 mm. The pad should be centered on the component.
  • To handle the ESD sensitivity of the BZX884-B4V7,315, it is recommended to use an ESD-protected workstation, wear an ESD strap, and use ESD-safe packaging and handling procedures. Additionally, the device should be stored in a conductive bag or container to prevent static electricity buildup.
  • The maximum power dissipation of the BZX884-B4V7,315 is 500 mW. However, the actual power dissipation will depend on the operating conditions, such as the voltage and current ratings, and the thermal resistance of the device.
  • The BZX884-B4V7,315 is rated for operation up to 150°C. However, the device's performance and reliability may degrade at high temperatures. It is recommended to derate the device's power dissipation and voltage ratings at high temperatures.
  • To ensure the reliability of the BZX884-B4V7,315 in a humid environment, it is recommended to use a moisture-resistant coating or conformal coating on the device, and to follow proper storage and handling procedures to prevent moisture ingress.

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BZX884-B4V7,315 Overview

Use the download button to access the BZX884-B4V7,315 schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like BZX88, or try a keyword search, such as Zener Diodes

About Nexperia

Nexperia is a leading global player in the semiconductor industry. Specializing in essential electronic components, Nexperia offers a diverse range of products including discrete components, MOSFETs, logic ICs, and analog ICs. These components are integral to a multitude of applications across automotive, industrial, consumer electronics, and computing sectors, where reliability, performance, and efficiency are paramount.

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