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BZX884-C6V2,315 - Nexperia

Description: Zener Diode 6.2 V 250 mW ±5% Surface Mount DFN1006-2

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Symbol
BZX884-C6V2,315 - Nexperia - PCB symbol
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PCB Footprints
BZX884-C6V2,315 - Nexperia PCB footprint - Other - Other - SOD882 (DFN1006-2)
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3D Models
BZX884-C6V2,315 - Nexperia - 3D model - Other - SOD882 (DFN1006-2)
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BZX884-C6V2,315 Details

  • Manufacturer Part Number:

    BZX884-C6V2,315

  • Brand Name:

    Nexperia

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    DFN

  • Package Description:

    SOD-882, DFN1006-2, 2 PIN

  • Pin Count:

    2

  • Manufacturer Package Code:

    SOD882

  • Country Of Origin:

    Mainland China, Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Factory Lead Time:

    8 Weeks

  • Manufacturer:

    Nexperia

  • YTEOL:

    7

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    ZENER DIODE

  • Dynamic Impedance-Max:

    10 Ω

  • JESD-30 Code:

    R-PBCC-N2

  • JESD-609 Code:

    e3

  • Knee Impedance-Max:

    150 Ω

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    CHIP CARRIER

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    UNIDIRECTIONAL

  • Power Dissipation-Max:

    0.25 W

  • Qualification Status:

    Not Qualified

  • Reference Standard:

    IEC-60134

  • Reference Voltage-Nom:

    6.2 V

  • Reverse Current-Max:

    3 µA

  • Reverse Test Voltage:

    4 V

  • Surface Mount:

    YES

  • Technology:

    ZENER

  • Terminal Finish:

    TIN

  • Terminal Form:

    NO LEAD

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Voltage Temp Coeff-Max:

    2.2 mV/°C

  • Voltage Tol-Max:

    5%

  • Working Test Current:

    5 mA

BZX884-C6V2,315 Frequently Asked Questions (FAQs)

  • The recommended land pattern for BZX884-C6V2,315 can be found in the Nexperia's SOT23 package outline drawing, which is available on the Nexperia website. The land pattern should ensure good thermal and electrical connections to the device.
  • To prevent ESD damage, it is recommended to use an ESD wrist strap or mat when handling the BZX884-C6V2,315. Additionally, the device should be stored in an anti-static bag or tube when not in use. It is also important to follow proper PCB design and layout guidelines to minimize ESD risks.
  • The maximum power dissipation of BZX884-C6V2,315 is dependent on the ambient temperature and the thermal resistance of the device. According to the datasheet, the maximum power dissipation is 250 mW at an ambient temperature of 25°C. However, this value can be derated at higher temperatures. It is recommended to consult the datasheet and perform thermal calculations to ensure the device operates within its safe operating area.
  • Yes, BZX884-C6V2,315 is a high-reliability device that is suitable for use in demanding applications. It is manufactured using a high-quality process and is subjected to rigorous testing and inspection. Additionally, Nexperia provides a range of reliability data and qualification reports to support the use of BZX884-C6V2,315 in high-reliability applications.
  • To determine the correct voltage rating for your application, you should consider the maximum voltage that the device will be exposed to, including any voltage transients or spikes. The BZX884-C6V2,315 has a voltage rating of 6.2 V, which means it can withstand voltages up to 6.2 V without damage. It is recommended to consult the datasheet and perform voltage derating calculations to ensure the device operates within its safe operating area.

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BZX884-C6V2,315 Overview

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About Nexperia

Nexperia is a leading global player in the semiconductor industry. Specializing in essential electronic components, Nexperia offers a diverse range of products including discrete components, MOSFETs, logic ICs, and analog ICs. These components are integral to a multitude of applications across automotive, industrial, consumer electronics, and computing sectors, where reliability, performance, and efficiency are paramount.

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