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C3D16060D - Wolfspeed

Description: 600 V, 16 A, TO-247-3 package, Industrial qualified, Discrete SiC Schottky Diode

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Symbol
C3D16060D - Wolfspeed - PCB symbol
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PCB Footprints
C3D16060D - Wolfspeed PCB footprint - Transistor Outline, Vertical - Transistor Outline, Vertical - TO-247-3L
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3D Models
C3D16060D - Wolfspeed - 3D model - Transistor Outline, Vertical - TO-247-3L
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C3D16060D Details

  • Manufacturer Part Number:

    C3D16060D

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Manufacturer:

    Wolfspeed

  • YTEOL:

    0

  • Application:

    EFFICIENCY

  • Case Connection:

    CATHODE

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON CARBIDE

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    1.8 V

  • JEDEC-95 Code:

    TO-247

  • JESD-30 Code:

    R-PSFM-T3

  • JESD-609 Code:

    e3

  • Non-rep Pk Forward Current-Max:

    440 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Current-Max:

    23 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Peak Reflow Temperature (Cel):

    260

  • Power Dissipation-Max:

    100 W

  • Rep Pk Reverse Voltage-Max:

    600 V

  • Reverse Current-Max:

    50 µA

  • Surface Mount:

    NO

  • Technology:

    SCHOTTKY

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    10

C3D16060D Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a thermal via array underneath the device is recommended. The thermal vias should be connected to a solid copper plane on the bottom layer to dissipate heat efficiently.
  • Ensure proper heat sinking, use a thermally conductive interface material, and follow the recommended PCB layout. Also, derate the device's power handling capability according to the temperature derating curve provided in the datasheet.
  • The device can withstand voltage transients up to 1.5 times the maximum rated voltage (VDS) for a duration of 100 ns or less. However, it's recommended to use a TVS diode or a voltage clamp to protect the device from voltage spikes.
  • Yes, the C3D16060D can be used in a half-bridge configuration. However, ensure that the device is properly biased, and the gate drive circuitry is designed to handle the high-speed switching requirements.
  • A gate drive voltage of 15-20 V and a current of 1-2 A is recommended. The gate drive circuitry should be designed to provide a fast rise and fall time (less than 10 ns) to minimize switching losses.

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C3D16060D Overview

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