A 2-layer or 4-layer PCB with a thermal via array underneath the device is recommended. The thermal vias should be connected to a solid copper plane on the bottom layer to dissipate heat efficiently.
Use a wire bond process with a gold or aluminum wire, and ensure the bond pad is clean and free of oxidation. Apply a bond force of 10-20 grams and a bond temperature of 150-200°C.
The maximum allowable voltage stress is 1.5 times the rated voltage (Vds) for a maximum of 10 seconds. Exceeding this limit may cause permanent damage to the device.
Handle the device in an ESD-controlled environment, and use ESD-protective packaging and handling materials. Ground yourself before handling the device, and avoid touching the device's pins or die.
Store the device in its original packaging or in a dry, ESD-protected environment. Avoid exposing the device to moisture, direct sunlight, or extreme temperatures.
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C3M0060065J Overview
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