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C5D25170H - Wolfspeed

Description: Schottky Diodes & Rectifiers SIC SCHOTTKY DIODE 1700V, 25A

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Symbol
C5D25170H - Wolfspeed - PCB symbol
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PCB Footprints
C5D25170H - Wolfspeed PCB footprint - Transistor Outline, Vertical - Transistor Outline, Vertical - Package TO-247-2
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3D Models
C5D25170H - Wolfspeed - 3D model - Transistor Outline, Vertical - Package TO-247-2
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C5D25170H Details

  • Manufacturer Part Number:

    C5D25170H

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    TO-247, 2 PIN

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Manufacturer:

    Wolfspeed

  • YTEOL:

    0

  • Additional Feature:

    FREE WHEELING DIODE, PD-CASE

  • Application:

    EFFICIENCY

  • Case Connection:

    CATHODE

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON CARBIDE

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    1.8 V

  • JEDEC-95 Code:

    TO-247

  • JESD-30 Code:

    R-PSFM-T2

  • Non-rep Pk Forward Current-Max:

    88 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Current-Max:

    70 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Power Dissipation-Max:

    384 W

  • Rep Pk Reverse Voltage-Max:

    1700 V

  • Reverse Current-Max:

    200 µA

  • Reverse Test Voltage:

    1700 V

  • Surface Mount:

    NO

  • Technology:

    SCHOTTKY

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

C5D25170H Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the C5D25170H is -55°C to 175°C.
  • To ensure proper biasing, follow the recommended biasing circuit and voltage levels outlined in the datasheet, and ensure that the device is operated within the recommended operating conditions.
  • A good PCB layout should minimize thermal resistance, ensure good heat sinking, and use a multi-layer board with a solid ground plane. A thermal management strategy should include a heat sink, thermal interface material, and a cooling system such as a fan or heat pipe.
  • Handle the device in an ESD-protected environment, wear an ESD strap, and use ESD-protected packaging and storage materials to prevent damage from electrostatic discharge.
  • Use a controlled soldering process with a peak temperature of 260°C, and follow the recommended assembly and soldering techniques outlined in the datasheet and industry standards such as IPC-J-STD-001.

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C5D25170H Overview

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