Wolfspeed recommends a 2-layer PCB with a thermal via array under the device to dissipate heat. A minimum of 10 thermal vias with a diameter of 0.3 mm, spaced 1.2 mm apart, is recommended. Additionally, a thermal pad with a minimum size of 5 mm x 5 mm is suggested.
To ensure reliable operation, it's essential to maintain a junction temperature (Tj) below 150°C. Monitor the device's temperature using a thermocouple or thermal imaging camera. Implement a thermal management strategy, such as heat sinks, fans, or liquid cooling, to keep the device within the recommended temperature range.
Wolfspeed recommends using a soldering temperature of 260°C (max) and a soldering time of 3 seconds (max) to prevent damage to the device. Use a solder with a melting point above 217°C, and ensure the PCB is clean and free of oxidation. A nitrogen atmosphere is recommended to reduce oxidation during soldering.
Handle the device by the package, avoiding touching the leads or die. Store the device in a dry, cool place, away from direct sunlight and moisture. Use anti-static packaging and follow ESD handling procedures to prevent damage.
Operating the device beyond the recommended conditions can lead to reduced performance, decreased lifespan, and increased risk of failure. Exceeding the maximum ratings can cause permanent damage, so it's essential to ensure the device operates within the recommended specifications.
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C6D04065E Overview
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