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C6D20065D - Wolfspeed

Description: 650 V, 20 A, TO-247-3 package, Industrial qualified, Discrete SiC Schottky Diode

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PCB Footprints
C6D20065D - Wolfspeed PCB footprint - Transistor Outline, Vertical - Transistor Outline, Vertical - TO-247-3L
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3D Models
C6D20065D - Wolfspeed  - 3D model - Transistor Outline, Vertical - TO-247-3L
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C6D20065D Details

  • Manufacturer Part Number:

    C6D20065D

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Manufacturer:

    Wolfspeed

  • YTEOL:

    6

  • Additional Feature:

    LOW LEAKAGE CURRENT, PD-CASE

  • Application:

    EFFICIENCY

  • Breakdown Voltage-Min:

    650 V

  • Case Connection:

    CATHODE

  • Configuration:

    COMMON CATHODE, 2 ELEMENTS

  • Diode Element Material:

    SILICON CARBIDE

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    1.5 V

  • JEDEC-95 Code:

    TO-247

  • JESD-30 Code:

    R-PSFM-T3

  • Non-rep Pk Forward Current-Max:

    75 A

  • Number of Elements:

    2

  • Number of Phases:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Current-Max:

    38 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Peak Reflow Temperature (Cel):

    260

  • Power Dissipation-Max:

    116 W

  • Rep Pk Reverse Voltage-Max:

    650 V

  • Reverse Current-Max:

    50 µA

  • Reverse Test Voltage:

    650 V

  • Surface Mount:

    NO

  • Technology:

    SCHOTTKY

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    10

C6D20065D Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the C6D20065D is -55°C to 175°C.
  • To ensure proper biasing, follow the recommended voltage and current ratings in the datasheet, and use a suitable biasing circuit to maintain a stable voltage supply.
  • For optimal thermal performance, use a multi-layer PCB with a thermal via structure, and ensure good thermal conductivity between the device and the heat sink. A heat sink with a thermal resistance of <1°C/W is recommended.
  • Use ESD protection devices such as TVS diodes or ESD arrays on the input and output pins, and follow proper handling and storage procedures to prevent ESD damage.
  • Follow the recommended soldering temperature profile and assembly procedures outlined in the datasheet, and use a solder with a melting point above 217°C to prevent thermal damage.

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C6D20065D Overview

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