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CAB008A12GM3T - Wolfspeed

Description: Discrete Semiconductor Modules SiC, Module, 8mohm, 1200V, 48 mm, AIN GM3, Half-Bridge, Industrial, Gen 3, Pre-Applied TIM

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CAB008A12GM3T Details

  • Manufacturer Part Number:

    CAB008A12GM3T

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • Manufacturer:

    Wolfspeed

  • YTEOL:

    5

  • Case Connection:

    ISOLATED

  • Configuration:

    SERIES CONNECTED, CENTER TAP, 2 ELEMENTS WITH BUILT-IN DIODE AND THERMISTOR

  • DS Breakdown Voltage-Min:

    1200 V

  • Drain-source On Resistance-Max:

    0.0104 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    43 pF

  • JESD-30 Code:

    R-XUFM-X38

  • Number of Elements:

    2

  • Number of Terminals:

    38

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    UNSPECIFIED

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    0.01 W

  • Pulsed Drain Current-Max (IDM):

    392 A

  • Reference Standard:

    IEC-60747-8-4

  • Surface Mount:

    NO

  • Terminal Form:

    UNSPECIFIED

  • Terminal Position:

    UPPER

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON CARBIDE

CAB008A12GM3T Frequently Asked Questions (FAQs)

  • Wolfspeed recommends a 2-layer PCB with a thermal pad on the bottom side, and a heat sink or thermal interface material (TIM) to ensure efficient heat dissipation. A minimum of 1 oz copper thickness is recommended for the PCB. Additionally, a thermal via array under the device can help to reduce thermal resistance.
  • To ensure reliable operation, it's essential to operate the device within the recommended temperature range (TJ ≤ 150°C). Monitor the device's temperature using the built-in thermistor (RθJA = 1.5°C/W) and implement a thermal management system to keep the junction temperature below the maximum rating. Also, ensure proper PCB design, layout, and thermal interface material selection.
  • Wolfspeed recommends using a high-frequency, low-impedance drive circuit with a gate resistor (RG) in the range of 10-20 ohms. A bootstrap circuit can be used to provide a high-side gate drive voltage. The drive circuit should be designed to minimize ringing and ensure a clean, fast switching waveform.
  • To minimize electromagnetic interference (EMI), use a shielded enclosure, and ensure proper PCB layout and grounding. Implement a common-mode choke or ferrite bead on the DC bus to reduce high-frequency noise. Additionally, consider using a snubber circuit or a damping resistor to reduce ringing and oscillations.
  • Wolfspeed recommends performing thorough testing and validation, including: 1) electrical characterization, 2) thermal performance testing, 3) reliability testing (e.g., temperature cycling, humidity testing), and 4) application-specific testing. Ensure that the test setup and procedures are designed to minimize the risk of device damage or degradation.

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CAB008A12GM3T Overview

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