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CAS13D31-722 - Sumida

Description: SMD,13.2x13.2mm,LF receiver antenna,

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PCB Footprints
CAS13D31-722 - Sumida PCB footprint - Other - Other - CAS13D31-722-1
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3D Models
CAS13D31-722 - Sumida  - 3D model - Other - CAS13D31-722-1
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CAS13D31-722 Details

  • Manufacturer Part Number:

    CAS13D31-722

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Manufacturer:

    Sumida Corporation

  • YTEOL:

    7

  • RF/Microwave Device Type:

    ANTENNA-OTHER

CAS13D31-722 Frequently Asked Questions (FAQs)

  • Sumida Corporation provides a recommended PCB layout and footprint in their application notes or design guides. It's essential to follow these guidelines to ensure optimal performance, minimize electromagnetic interference (EMI), and reduce thermal resistance.
  • To ensure reliability and prevent overheating, it's crucial to follow the recommended operating temperature range, derate the current according to the temperature, and provide adequate airflow around the inductor. Additionally, consider using a thermal interface material (TIM) to improve heat transfer between the inductor and the PCB.
  • The SRF of the CAS13D31-722 is not explicitly stated in the datasheet. However, it's typically in the range of 100-200 MHz for similar inductors. The SRF can affect the circuit design by causing unwanted resonances and affecting the overall impedance. It's essential to consider the SRF when designing the circuit and to use simulation tools to optimize the design.
  • While the datasheet doesn't provide explicit information on vibration and shock resistance, Sumida Corporation's inductors are generally designed to meet the requirements of various industrial and automotive standards. However, it's recommended to consult with Sumida Corporation or a qualified engineer to determine the inductor's suitability for high-vibration or high-shock environments.
  • To minimize EMI, it's essential to follow proper PCB layout and design practices, such as keeping the inductor away from sensitive components, using shielding, and implementing proper grounding techniques. Additionally, consider using a magnetic shield or a mu-metal shield to contain the magnetic field.

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