Bourns provides a recommended PCB layout and land pattern in their application note AN164, which can be found on their website. Following this layout ensures optimal performance, minimal parasitic inductance, and reduced electromagnetic interference (EMI).
To minimize the impact of SRF, ensure that the inductor's SRF is above the operating frequency of your circuit. You can also use a shield or a Faraday shield to reduce electromagnetic radiation and coupling. Additionally, consider using a different inductor with a higher SRF or a lower Q factor if necessary.
The maximum allowed voltage across the inductor is not explicitly stated in the datasheet, but it's typically limited by the core material's saturation characteristics. As a general rule, the inductance value decreases as the voltage across the inductor increases. Consult Bourns' application notes or contact their support team for specific guidance on voltage derating and inductance variation.
The temperature coefficient of inductance (TCIL) is typically around -0.04%/°C for the CAT16-1501F4LF. To minimize the impact of temperature on inductance, consider using a thermally stable inductor or a design that compensates for temperature variations. You can also consult Bourns' application notes for guidance on temperature derating and inductance variation.
To prevent damage, store the inductors in their original packaging or a similar protective environment. Avoid exposing them to mechanical stress, high temperatures, or humidity. Handle the inductors by the body, not the leads, to prevent bending or damage. Follow standard ESD precautions when handling the inductors to prevent electrostatic discharge damage.
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