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CAT16-511J4LF - Bourns

Description: Res Thick Film Array 510 Ohm 5% 0.25W(1/4W) ±200ppm/°C ISOL 8-Pin 1206(4 X 0603) Concave SMD T/R

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CAT16-511J4LF - Bourns PCB footprint - Other - Other - CAT16_J4
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CAT16-511J4LF - Bourns  - 3D model - Other - CAT16_J4
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CAT16-511J4LF Details

  • Manufacturer Part Number:

    CAT16-511J4LF

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • Reach Compliance Code:

    Compliant

  • ECCN Code:

    EAR99

  • HTS Code:

    8533.21.00.20

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Bourns Inc

  • YTEOL:

    8

  • Construction:

    Rectangular

  • Element Power Dissipation:

    0.0625 W

  • First Element Resistance:

    510 Ω

  • JESD-609 Code:

    e3

  • Mounting Feature:

    SURFACE MOUNT

  • Network Type:

    ISOLATED

  • Number of Elements:

    1

  • Number of Functions:

    4

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.5 mm

  • Package Length:

    3.2 mm

  • Package Shape:

    RECTANGULAR PACKAGE

  • Package Style:

    SMT

  • Package Width:

    1.55 mm

  • Packing Method:

    TR, PAPER, 7 INCH

  • Rated Power Dissipation (P):

    0.25 W

  • Rated Temperature:

    70 °C

  • Resistance:

    510 Ω

  • Resistor Type:

    ARRAY/NETWORK RESISTOR

  • Second/Last Element Resistance:

    510 Ω

  • Size Code:

    1206

  • Surface Mount:

    YES

  • Technology:

    METAL GLAZE/THICK FILM

  • Temperature Coefficient:

    200 ppm/°C

  • Terminal Finish:

    Tin (Sn) - with Nickel (Ni) barrier

  • Terminal Shape:

    WRAPAROUND

  • Tolerance:

    5%

  • Working Voltage:

    50 V

CAT16-511J4LF Frequently Asked Questions (FAQs)

  • Bourns recommends a symmetrical PCB layout with a solid ground plane, and keeping the input and output traces as short as possible to minimize parasitic inductance and capacitance. Additionally, it's recommended to use a 4-layer PCB with a dedicated power plane and a dedicated ground plane.
  • To ensure proper soldering, use a soldering iron with a temperature range of 250°C to 260°C, and apply a small amount of solder paste to the pads. Use a reflow oven or a hot air gun to solder the component, and avoid applying excessive force or pressure during the soldering process. Inspect the solder joints under a microscope to ensure they are smooth and shiny, and free of cold solder joints.
  • The CAT16-511J4LF is rated for operation from -40°C to +125°C, but it's recommended to derate the component's performance at temperatures above 100°C to ensure reliable operation and prevent thermal runaway.
  • To prevent electrostatic discharge (ESD) damage, handle the CAT16-511J4LF with an ESD wrist strap or mat, and ensure that the workspace is ESD-protected. Avoid touching the component's pins or exposed metal surfaces, and use ESD-safe packaging and storage materials.
  • Store the CAT16-511J4LF in its original packaging or in a dry, ESD-protected environment. Avoid exposing the component to moisture, direct sunlight, or extreme temperatures. Handle the component by the body, not the leads, and avoid bending or flexing the leads during handling or storage.

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CAT16-511J4LF Overview

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Part Image EXBV8V511JV Panasonic Electronic Components

Array/Network Resistor, Isolated, Metal Glaze/thick Film, 0.063W, 510ohm, 50V, 5% +/-Tol, 200ppm/Cel, Surface Mount, 1206, CHIP

Part Image NRSN06I4J511TRF NIC Components Corp

Array/Network Resistor, Isolated, Metal Glaze/thick Film, 0.0625W, 510ohm, 50V, 5% +/-Tol, 200ppm/Cel, Surface Mount, 0612, CHIP, ROHS COMPLIANT

Part Image CAT16-511J4 Bourns Inc

Array/Network Resistor, Isolated, 0.062W, 510ohm, 50V, 5% +/-Tol, Surface Mount, 0612

Part Image NRSN06I4J511TR NIC Components Corp

Array/Network Resistor, Isolated, Metal Glaze/thick Film, 0.0625W, 510ohm, 50V, 5% +/-Tol, -200,200ppm/Cel, 1206,