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CAT25256XI-T2 - onsemi

Description: 20 MHz (5 V) SPI Compatible; 1.8 V to 5.5 V Supply Voltage Range; SPI Modes (0,0) & (1,1); 64-byte Page Write Buffer; Additional Identification Page with Permanent Write Protection (New Product); Self-timed Write Cycle; Hardware and Software Protection; Block Write Protection - Protect 1/4, 1/2 or Entire EEPROM Array; Low Power CMOS Technology; 1,000,000 Program/Erase Cycles; 100 Year Data Retention; Industrial Temperature Range; 8-lead SOIC, TSSOP and 8-pad UDFN Packages; This Device is Pb-Free, Halogen Fr

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CAT25256XI-T2 - onsemi PCB footprint - Small Outline Packages - Small Outline Packages - SOIC8-CASE751BD-01
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CAT25256XI-T2 - onsemi  - 3D model - Small Outline Packages - SOIC8-CASE751BD-01
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CAT25256XI-T2 Details

  • Manufacturer Part Number:

    CAT25256XI-T2

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC-8, 208 mils

  • Pin Count:

    8

  • Manufacturer Package Code:

    751BE

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.32.00.51

  • Factory Lead Time:

    14 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    5

  • Additional Feature:

    100 YEAR DATA RETENTION

  • Clock Frequency-Max (fCLK):

    5 MHz

  • Data Retention Time-Min:

    100

  • Endurance:

    1000000 Write/Erase Cycles

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    5.255 mm

  • Memory Density:

    262144 bit

  • Memory IC Type:

    EEPROM

  • Memory Width:

    8

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Number of Words:

    32768 words

  • Number of Words Code:

    32000

  • Operating Mode:

    SYNCHRONOUS

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    32KX8

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.3

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Parallel/Serial:

    SERIAL

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    2.03 mm

  • Serial Bus Type:

    SPI

  • Standby Current-Max:

    0.000001 A

  • Supply Current-Max:

    0.004 mA

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    1.8 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    5.23 mm

  • Write Cycle Time-Max (tWC):

    5 ms

  • Write Protection:

    HARDWARE/SOFTWARE

CAT25256XI-T2 Frequently Asked Questions (FAQs)

  • A good PCB layout for the CAT25256XI-T2 involves keeping the power and ground pins as close as possible to the device, using a solid ground plane, and minimizing the length of the VCC and GND traces. Additionally, it's recommended to use a 0.1uF decoupling capacitor between VCC and GND, placed as close to the device as possible.
  • To ensure the CAT25256XI-T2 operates within the recommended operating conditions, make sure to operate the device within the specified voltage range (2.7V to 5.5V), keep the junction temperature below 125°C, and avoid exceeding the maximum ratings for voltage, current, and power dissipation.
  • The recommended storage temperature range for the CAT25256XI-T2 is -65°C to 150°C. Storing the device outside of this range may affect its reliability and performance.
  • Yes, the CAT25256XI-T2 is suitable for high-reliability and automotive applications. It meets the requirements of the AEC-Q100 standard for automotive applications and is manufactured using a high-reliability process.
  • When soldering or reworking the CAT25256XI-T2, follow the recommended soldering temperature profile, avoid overheating the device, and use a soldering iron with a temperature-controlled tip. Also, ensure the device is handled in a static-safe environment to prevent electrostatic discharge (ESD) damage.

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