1 MM HEIGHT, HALOGEN FREE AND ROHS COMPLIANT, MO-193, TSOT-23, 6 PIN
Pin Count:
6
Manufacturer Package Code:
419AF
Country Of Origin:
Thailand
ECCN Code:
EAR99
HTS Code:
8542.39.00.60
Factory Lead Time:
2 Days
Manufacturer:
onsemi
YTEOL:
0
Analog IC - Other Type:
SWITCHED CAPACITOR REGULATOR
Control Mode:
VOLTAGE-MODE
Control Technique:
PULSE WIDTH MODULATION
Input Voltage-Max:
4.5 V
Input Voltage-Min:
2.7 V
Input Voltage-Nom:
3.6 V
JESD-30 Code:
R-PDSO-G6
JESD-609 Code:
e4
Length:
2.9 mm
Moisture Sensitivity Level:
1
Number of Functions:
1
Number of Terminals:
6
Operating Temperature-Max:
85 °C
Operating Temperature-Min:
-40 °C
Output Current-Max:
0.2 A
Output Voltage-Nom:
5 V
Package Body Material:
PLASTIC/EPOXY
Package Code:
VSSOP
Package Equivalence Code:
TSOP6,.11,37
Package Shape:
RECTANGULAR
Package Style:
SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Cel):
260
Qualification Status:
Not Qualified
Seated Height-Max:
1 mm
Surface Mount:
YES
Switcher Configuration:
DOUBLER INVERTER
Switching Frequency-Max:
2600 kHz
Temperature Grade:
INDUSTRIAL
Terminal Finish:
NICKEL PALLADIUM GOLD
Terminal Form:
GULL WING
Terminal Pitch:
0.95 mm
Terminal Position:
DUAL
Time@Peak Reflow Temperature-Max (s):
30
Width:
1.6 mm
CAT3200TDI-GT3 Frequently Asked Questions (FAQs)
A 4-layer PCB with a solid ground plane and thermal vias is recommended. The device should be placed near a thermal pad or heat sink to dissipate heat efficiently.
Ensure that the device is operated within the recommended voltage and current limits, and that the PCB is designed to minimize thermal resistance. Also, consider using thermal protection circuits or thermal sensors to monitor the device temperature.
The high current handling capability of the CAT3200TDI-GT3 requires careful PCB design to ensure that the traces and vias can handle the high currents. Use wide traces, multiple vias, and consider using a copper pour to reduce resistance and inductance.
Use a multi-layer PCB with a solid ground plane, and ensure that the device is placed away from noise sources. Use shielding, filtering, and decoupling capacitors as needed to minimize EMI. Also, consider using a common-mode choke to reduce common-mode noise.
Ensure that the device is operated within the recommended voltage and current limits, and that the PCB is designed to minimize electromagnetic radiation. Use shielding, filtering, and decoupling capacitors as needed to minimize electromagnetic radiation.
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CAT3200TDI-GT3 Overview
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