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CAT3200TDI-GT3 - onsemi

Description: DC-DC Converter

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PCB Footprints
CAT3200TDI-GT3 - onsemi PCB footprint - SOT23 (6-Pin) - SOT23 (6-Pin) - TSOT-23
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3D Models
CAT3200TDI-GT3 - onsemi  - 3D model - SOT23 (6-Pin) - TSOT-23
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CAT3200TDI-GT3 Details

  • Manufacturer Part Number:

    CAT3200TDI-GT3

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    TSOT-23, 6 Lead

  • Package Description:

    1 MM HEIGHT, HALOGEN FREE AND ROHS COMPLIANT, MO-193, TSOT-23, 6 PIN

  • Pin Count:

    6

  • Manufacturer Package Code:

    419AF

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    2 Days

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Analog IC - Other Type:

    SWITCHED CAPACITOR REGULATOR

  • Control Mode:

    VOLTAGE-MODE

  • Control Technique:

    PULSE WIDTH MODULATION

  • Input Voltage-Max:

    4.5 V

  • Input Voltage-Min:

    2.7 V

  • Input Voltage-Nom:

    3.6 V

  • JESD-30 Code:

    R-PDSO-G6

  • JESD-609 Code:

    e4

  • Length:

    2.9 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    6

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current-Max:

    0.2 A

  • Output Voltage-Nom:

    5 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    VSSOP

  • Package Equivalence Code:

    TSOP6,.11,37

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1 mm

  • Surface Mount:

    YES

  • Switcher Configuration:

    DOUBLER INVERTER

  • Switching Frequency-Max:

    2600 kHz

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    NICKEL PALLADIUM GOLD

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.95 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    1.6 mm

CAT3200TDI-GT3 Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and thermal vias is recommended. The device should be placed near a thermal pad or heat sink to dissipate heat efficiently.
  • Ensure that the device is operated within the recommended voltage and current limits, and that the PCB is designed to minimize thermal resistance. Also, consider using thermal protection circuits or thermal sensors to monitor the device temperature.
  • The high current handling capability of the CAT3200TDI-GT3 requires careful PCB design to ensure that the traces and vias can handle the high currents. Use wide traces, multiple vias, and consider using a copper pour to reduce resistance and inductance.
  • Use a multi-layer PCB with a solid ground plane, and ensure that the device is placed away from noise sources. Use shielding, filtering, and decoupling capacitors as needed to minimize EMI. Also, consider using a common-mode choke to reduce common-mode noise.
  • Ensure that the device is operated within the recommended voltage and current limits, and that the PCB is designed to minimize electromagnetic radiation. Use shielding, filtering, and decoupling capacitors as needed to minimize electromagnetic radiation.

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CAT3200TDI-GT3 Overview

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