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CAV25256VE-GT3 - onsemi

Description: Automotive Temperature Grade 1 (-40°C to +125°C); 10 MHz (5 V) SPI Compatible; 2.5 V to 5.5 V Supply Voltage Range; SPI Modes (0,0) & (1,1); 64-byte Page Write Buffer; Self-timed Write Cycle; Hardware and Software Protection; CAV Prefix for Automotive and Other Applications Requiring Site and Change Control; Block Write Protection - Protect ¼, ½ or Entire EEPROM Array; Low Power CMOS Technology; 1,000,000 Program/Erase Cycles; 100 Year Data Retention; 8-lead SOIC and TSSOP Packages; This Device is Pb-Free,

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PCB Footprints
CAV25256VE-GT3 - onsemi PCB footprint - Small Outline Packages - Small Outline Packages - SOIC 8, 150 mils
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3D Models
CAV25256VE-GT3 - onsemi  - 3D model - Small Outline Packages - SOIC 8, 150 mils
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CAV25256VE-GT3 Details

  • Manufacturer Part Number:

    CAV25256VE-GT3

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC 8, 150 mils

  • Package Description:

    SOIC-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    751BD

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.32.00.51

  • Factory Lead Time:

    10 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    5

  • Clock Frequency-Max (fCLK):

    10 MHz

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    4.9 mm

  • Memory Density:

    262144 bit

  • Memory IC Type:

    EEPROM

  • Memory Width:

    8

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Number of Words:

    32768 words

  • Number of Words Code:

    32000

  • Operating Mode:

    SYNCHRONOUS

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    32KX8

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Parallel/Serial:

    SERIAL

  • Peak Reflow Temperature (Cel):

    260

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    1.75 mm

  • Serial Bus Type:

    SPI

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    2.5 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3.9 mm

  • Write Cycle Time-Max (tWC):

    5 ms

CAV25256VE-GT3 Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and thermal vias is recommended. Ensure a minimum of 1 oz copper thickness and a thermal relief pattern under the device.
  • Implement a robust thermal management system, including a heat sink and thermal interface material. Ensure good airflow and avoid hot spots.
  • Monitor the device's junction temperature, output voltage, and current. Implement over-temperature, over-voltage, and over-current protection mechanisms.
  • Yes, the CAV25256VE-GT3 is AEC-Q100 qualified and suitable for automotive and high-reliability applications. Ensure compliance with relevant industry standards and guidelines.
  • Use a shielded enclosure, keep sensitive components away from the device, and implement EMI filters or chokes as needed. Follow good PCB layout practices and consider using a common-mode choke.

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CAV25256VE-GT3 Overview

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