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CAV25M01VE-GT3 - onsemi

Description: Automotive Temperature Grade 1 (-40°C to +125°C); 10 MHz SPI Compatible; 2.5 V to 5.5 V Supply Voltage Range; SPI Modes (0,0) & (1,1); 256-byte Page Write Buffer; Additional Identification Page with Permanent Write Protection; Self-timed Write Cycle; Hardware and Software Protection; Block Write Protection - Protect ¼, ½ or Entire EEPROM Array; Low Power CMOS Technology; 1,000,000 Program/Erase Cycles; 100 Year Data Retention; 8 lead SOIC and TSSOP Packages; This Device is PbFree, Halogen Free/BFR Free and

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PCB Footprints
CAV25M01VE-GT3 - onsemi PCB footprint - Small Outline Packages - Small Outline Packages - SOIC 8, 150 mils
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3D Models
CAV25M01VE-GT3 - onsemi  - 3D model - Small Outline Packages - SOIC 8, 150 mils
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CAV25M01VE-GT3 Details

  • Manufacturer Part Number:

    CAV25M01VE-GT3

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC 8, 150 mils

  • Package Description:

    SOIC-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    751BD

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.32.00.51

  • Factory Lead Time:

    20 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    5

  • Clock Frequency-Max (fCLK):

    10 MHz

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    4.9 mm

  • Memory Density:

    1048576 bit

  • Memory IC Type:

    EEPROM

  • Memory Width:

    8

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Number of Words:

    131072 words

  • Number of Words Code:

    128000

  • Operating Mode:

    SYNCHRONOUS

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    128KX8

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    VSSOP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH

  • Parallel/Serial:

    SERIAL

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    0.39 mm

  • Serial Bus Type:

    SPI

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    2.5 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3.9 mm

  • Write Cycle Time-Max (tWC):

    5 ms

CAV25M01VE-GT3 Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. The device should be placed near a thermal pad or heat sink to dissipate heat efficiently.
  • Ensure that the device is operated within the recommended voltage and current ratings, and that the PCB is designed to minimize thermal resistance. Also, consider using a thermal interface material (TIM) to improve heat transfer between the device and heat sink.
  • The critical timing parameters include the input rise and fall times, output delay, and propagation delay. These parameters are critical for ensuring reliable operation and should be carefully considered during design and testing.
  • ESD protection can be achieved through the use of ESD protection diodes, TVS diodes, or other ESD protection devices. It is also important to follow proper handling and storage procedures to prevent ESD damage.
  • The recommended soldering conditions include a peak temperature of 260°C, a soldering time of 10-30 seconds, and a soldering method that minimizes thermal shock and mechanical stress.

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CAV25M01VE-GT3 Overview

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EEPROM, 128KX8, Serial, CMOS, PDSO8