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CAY16-2002F4LF - Bourns

Description: Res Thick Film Array 20K Ohm 1% 0.25W(1/4W) ±200ppm/C ISOL Molded 8-Pin 1206(4 X 0603) Convex SMD T/R

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CAY16-2002F4LF - Bourns PCB footprint - Other - Other - CAY16-2002F4LF-1
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CAY16-2002F4LF - Bourns  - 3D model - Other - CAY16-2002F4LF-1
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CAY16-2002F4LF Details

  • Manufacturer Part Number:

    CAY16-2002F4LF

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • Reach Compliance Code:

    Compliant

  • ECCN Code:

    EAR99

  • HTS Code:

    8533.21.00.20

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Bourns Inc

  • YTEOL:

    8

  • Construction:

    Rectangular

  • Element Power Dissipation:

    0.0625 W

  • First Element Resistance:

    20000 Ω

  • JESD-609 Code:

    e3

  • Mounting Feature:

    SURFACE MOUNT

  • Network Type:

    ISOLATED

  • Number of Elements:

    1

  • Number of Functions:

    4

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.5 mm

  • Package Length:

    3.2 mm

  • Package Shape:

    RECTANGULAR PACKAGE

  • Package Style:

    SMT

  • Package Width:

    1.6 mm

  • Packing Method:

    TR, PAPER, 7 INCH

  • Rated Power Dissipation (P):

    0.25 W

  • Rated Temperature:

    70 °C

  • Resistance:

    20000 Ω

  • Resistor Type:

    ARRAY/NETWORK RESISTOR

  • Second/Last Element Resistance:

    20000 Ω

  • Size Code:

    1206

  • Surface Mount:

    YES

  • Technology:

    METAL GLAZE/THICK FILM

  • Temperature Coefficient:

    200 ppm/°C

  • Terminal Finish:

    Tin (Sn) - with Nickel (Ni) barrier

  • Terminal Shape:

    WRAPAROUND

  • Tolerance:

    1%

  • Working Voltage:

    50 V

CAY16-2002F4LF Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for the CAY16-2002F4LF is a 4-pin SMD package with a 1.6mm x 1.2mm body size. The recommended land pattern is available in the Bourns application note AN164.
  • To ensure reliable soldering, follow the recommended soldering profile and use a solder with a melting point below 260°C. Avoid excessive heat and use a soldering iron with a temperature control. Refer to the Bourns application note AN164 for more information.
  • The maximum operating temperature range for the CAY16-2002F4LF is -40°C to +125°C. However, the device can be stored at temperatures between -40°C and +150°C.
  • The CAY16-2002F4LF has built-in ESD protection, but it's still recommended to follow proper ESD handling procedures during assembly and testing. Use an ESD wrist strap or mat, and ensure that all equipment is properly grounded.
  • The recommended torque for the CAY16-2002F4LF is not applicable, as it is a surface-mount device and does not require torque.

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CAY16-2002F4LF Overview

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