CBC2012T2R2M footprint, schematic symbol and 3D model by TAIYO YUDEN

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CBC2012T2R2M Details

The recommended land pattern for the CBC2012T2R2M is a rectangular pad with a size of 2.5mm x 1.25mm, with a solder mask opening of 2.2mm x 1.0mm.
The CBC2012T2R2M has a thermal resistance of 30°C/W. To handle thermal considerations, ensure good airflow around the component, use a thermal pad or heat sink if necessary, and avoid overheating the component.
The maximum operating temperature for the CBC2012T2R2M is 125°C, with a storage temperature range of -40°C to 125°C.
To ensure reliability in high-vibration environments, use a secure mounting method, such as soldering or adhesive, and consider using a vibration-dampening material or potting compound to reduce stress on the component.
The recommended soldering profile for the CBC2012T2R2M is a peak temperature of 260°C, with a soldering time of 3-5 seconds, and a preheating temperature of 150°C to 180°C.

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