Cosel USA Inc recommends a multi-layer PCB with a large ground plane and thermal vias to dissipate heat. A minimum of 2oz copper thickness is recommended. Additionally, a thermal interface material (TIM) with a thermal conductivity of at least 1 W/m-K is suggested between the module and the heat sink.
To ensure EMC, Cosel USA Inc recommends following the guidelines in the datasheet for proper PCB layout, component placement, and shielding. Additionally, the use of a metal enclosure and proper cable shielding is recommended. It is also important to follow the relevant EMC standards for the target application.
The derating curve for the CBS502424 is available upon request from Cosel USA Inc. The curve provides the maximum output power at different ambient temperatures. As the ambient temperature increases, the output power must be derated to prevent overheating and ensure reliable operation.
Yes, the CBS502424 can be used in a redundant or N+1 configuration. However, it is essential to follow the guidelines in the datasheet for proper synchronization and control of the multiple modules. Additionally, the system designer should ensure that the total output power and current are within the specified limits.
The MTBF of the CBS502424 is calculated based on the Telcordia SR-332 standard. The MTBF is approximately 1.5 million hours at 40°C ambient temperature. However, this value may vary depending on the specific application and operating conditions.
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CBS502424 Overview
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