CBT3306D-Q100J footprint, schematic symbol and 3D model by Nexperia

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PCB Footprints

CBT3306D-Q100J - Nexperia PCB footprint - Other - Other - SOT96-1: SO8

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Part Number CBT3306D-Q100J
Manufacturer Nexperia
Pin Count 8
Part Category Integrated Circuit
Package Category Other
Footprint Name Other - SOT96-1: SO8
Released Date Nov 4, 2019
Last Modified Date Mar 7, 2023 4:10 PM UTC
Pinout / Pin List Click Here (Member Only)

CBT3306D-Q100J Details

Manufacturer Part Number:
CBT3306D-Q100J
Brand Name:
Nexperia
Rohs Code:
Yes
Part Life Cycle Code:
Obsolete
Part Package Code:
SOIC
Package Description:
SOP-8
Pin Count:
8
Manufacturer Package Code:
SOT96-1
HTS Code:
8542.39.00.60
Factory Lead Time:
4 Weeks
Date Of Intro:
2017-02-01
Manufacturer:
Nexperia
YTEOL:
0
Control Type:
ENABLE LOW
Count Direction:
UNIDIRECTIONAL
Family:
CBT/FST/QS/5C/B
JESD-30 Code:
R-PDSO-G8
Length:
4.9 mm
Load Capacitance (CL):
50 pF
Logic IC Type:
BUS DRIVER
Number of Bits:
1
Number of Functions:
2
Number of Ports:
2
Number of Terminals:
8
Operating Temperature-Max:
85 °C
Operating Temperature-Min:
-40 °C
Output Characteristics:
3-STATE
Output Polarity:
TRUE
Package Body Material:
PLASTIC/EPOXY
Package Code:
SOP
Package Shape:
RECTANGULAR
Package Style:
SMALL OUTLINE
Peak Reflow Temperature (Cel):
NOT SPECIFIED
Power Supply Current-Max (ICC):
0.003 mA
Prop. Delay@Nom-Sup:
0.25 ns
Propagation Delay (tpd):
0.25 ns
Screening Level:
AEC-Q100
Seated Height-Max:
1.75 mm
Supply Voltage-Max (Vsup):
5.5 V
Supply Voltage-Min (Vsup):
4.5 V
Supply Voltage-Nom (Vsup):
5 V
Surface Mount:
YES
Technology:
CMOS
Temperature Grade:
INDUSTRIAL
Terminal Form:
GULL WING
Terminal Pitch:
1.27 mm
Terminal Position:
DUAL
Time@Peak Reflow Temperature-Max (s):
NOT SPECIFIED
Width:
3.9 mm

CBT3306D-Q100J Frequently Asked Questions (FAQs)

Nexperia provides a recommended PCB layout in their application note AN11173, which includes guidelines for component placement, routing, and thermal management to ensure optimal performance and minimize electromagnetic interference (EMI).
The CBT3306D-Q100J has a thermal pad on the bottom of the package, which should be connected to a thermal ground plane on the PCB to dissipate heat. Additionally, Nexperia recommends using a thermal interface material (TIM) between the device and the heat sink to improve thermal conductivity.
The CBT3306D-Q100J is rated for operation from -40°C to 125°C, but Nexperia recommends derating the device's power dissipation above 85°C to ensure reliable operation.
Yes, the CBT3306D-Q100J is qualified to AEC-Q100, which is a standard for automotive-grade semiconductor devices. However, Nexperia recommends consulting their application notes and reliability reports to ensure the device meets the specific requirements of your application.
Nexperia provides a troubleshooting guide in their application note AN11174, which covers common issues such as overheating, electrical overstress, and package damage. Additionally, engineers can contact Nexperia's technical support team for further assistance.

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CBT3306D-Q100J Overview

Use the download button to access the CBT3306D-Q100J schematic symbol and PCB footprint.

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About Nexperia

Nexperia is a leading global player in the semiconductor industry. Specializing in essential electronic components, Nexperia offers a diverse range of products including discrete components, MOSFETs, logic ICs, and analog ICs. These components are integral to a multitude of applications across automotive, industrial, consumer electronics, and computing sectors, where reliability, performance, and efficiency are paramount.

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