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CBTL04DP211BS,518 - NXP

Description: Multiplexer -40°C to 85°C 32-Pin HVQFN EP T/R

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Symbol
CBTL04DP211BS,518 - NXP - PCB symbol
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PCB Footprints
CBTL04DP211BS,518 - NXP PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - SOT1185-1
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3D Models
CBTL04DP211BS,518 - NXP - 3D model - Quad Flat No-Lead - SOT1185-1
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CBTL04DP211BS,518 Details

  • Manufacturer Part Number:

    CBTL04DP211BS,518

  • Brand Name:

    NXP Semiconductor

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    QFN

  • Package Description:

    3 X 6 MM, 0.40 MM PITCH, 0.85 MM HEIGHT, PLASTIC, SOT1185-1, HVQFN-32

  • Pin Count:

    32

  • Manufacturer Package Code:

    SOT1185-1

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    4 Weeks

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    0

  • Family:

    CBT/FST/QS/5C/B

  • JESD-30 Code:

    R-PQCC-N32

  • Length:

    6 mm

  • Logic IC Type:

    MULTIPLEXER

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Inputs:

    2

  • Number of Outputs:

    1

  • Number of Terminals:

    32

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Polarity:

    CONFIGURABLE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVQCCN

  • Package Shape:

    RECTANGULAR

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Power Supply Current-Max (ICC):

    0.5 mA

  • Seated Height-Max:

    1 mm

  • Supply Voltage-Max (Vsup):

    3.6 V

  • Supply Voltage-Min (Vsup):

    3 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.4 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3 mm

CBTL04DP211BS,518 Frequently Asked Questions (FAQs)

  • A good PCB layout for the CBTL04DP211BS involves keeping the signal paths short, using a solid ground plane, and placing the device close to the transmission line. It's also recommended to use a 50-ohm microstrip line and to minimize vias and layer transitions.
  • To ensure signal integrity, use a controlled impedance PCB design, minimize signal reflections, and use a common mode filter or a common mode choke to reduce electromagnetic interference (EMI). Additionally, use a low-jitter clock source and ensure proper termination of the transmission line.
  • The CBTL04DP211BS is designed to operate up to 3.2 Gbps, but the actual maximum operating frequency may vary depending on the specific application, PCB design, and signal quality. It's recommended to consult the datasheet and application notes for more information.
  • The CBTL04DP211BS has a maximum junction temperature of 150°C. To ensure proper thermal management, use a heat sink or a thermal pad, and ensure good airflow around the device. It's also recommended to follow the recommended PCB layout and thermal design guidelines provided in the datasheet.
  • It's recommended to use a low-ESR capacitor (e.g., 100 nF) for power supply decoupling, and a ferrite bead or a pi-filter for power supply filtering. The decoupling capacitor should be placed as close as possible to the device, and the filtering components should be placed on the power supply lines.

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CBTL04DP211BS,518 Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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