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CBTU02044HEJ - NXP

Description: High-speed two-differential channels 1-to-2 switch , 14 Ohms , - 70 dB , 17 GHz , 1.62 V to 3.63 V , - 40 °C to +85 °C

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PCB Footprints
CBTU02044HEJ - NXP PCB footprint - Other - Other - SOT1832-1_2026
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3D Models
CBTU02044HEJ - NXP  - 3D model - Other - SOT1832-1_2026
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CBTU02044HEJ Details

  • Manufacturer Part Number:

    CBTU02044HEJ

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    HUQFN-16

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    7.88

  • Analog IC - Other Type:

    DIFFERENTIAL MULTIPLEXER

  • JESD-30 Code:

    R-PQCC-N16

  • JESD-609 Code:

    e4

  • Length:

    2.4 mm

  • Moisture Sensitivity Level:

    1

  • Normal Position:

    NO

  • Number of Channels:

    2

  • Number of Functions:

    1

  • Number of Terminals:

    16

  • Off-state Isolation-Nom:

    18 dB

  • On-state Resistance-Max (Ron):

    14 Ω

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output:

    SEPARATE OUTPUT

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC16,.06x.09,16

  • Package Shape:

    RECTANGULAR

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    0.55 mm

  • Supply Current-Max (Isup):

    0.45 mA

  • Supply Voltage-Max (Vsup):

    3.63 V

  • Supply Voltage-Min (Vsup):

    1.62 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Switch-off Time-Max:

    0.035 ns

  • Switch-on Time-Max:

    0.035 ns

  • Switching:

    BREAK-BEFORE-MAKE

  • Technology:

    CMOS

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.4 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    1.6 mm

CBTU02044HEJ Frequently Asked Questions (FAQs)

  • A symmetrical layout with a solid ground plane and minimal signal trace length is recommended. Ensure that the input and output pins are separated by a sufficient distance to minimize crosstalk.
  • Ensure proper heat dissipation by providing adequate airflow, using a heat sink if necessary, and avoiding thermal hotspots. Monitor the device's temperature using a thermocouple or thermal imaging camera.
  • Exceeding maximum ratings can lead to permanent damage, reduced lifespan, or even catastrophic failure. Ensure that the device operates within the specified voltage, current, and temperature ranges to prevent damage.
  • Use a systematic approach to troubleshoot: verify the power supply, check for proper PCB layout and component placement, and use oscilloscopes or logic analyzers to monitor signals. Consult the datasheet and application notes for guidance.
  • Yes, handle the device with ESD-protective equipment, such as wrist straps or mats, and ensure that the workspace is ESD-safe. Avoid touching the device's pins or exposing it to static electricity.

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CBTU02044HEJ Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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