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CC1210JKNPOBBN102 - Yageo Group

Description: Multilayer Ceramic Capacitors MLCC - SMD/SMT 1.0nF 500V NPO 5%

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PCB Footprints
CC1210JKNPOBBN102 - Yageo Group PCB footprint - Capacitor Chip Non-polarised - Capacitor Chip Non-polarised - CC1210-ren2
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3D Models
CC1210JKNPOBBN102 - Yageo Group  - 3D model - Capacitor Chip Non-polarised - CC1210-ren2
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CC1210JKNPOBBN102 Details

  • Manufacturer Part Number:

    CC1210JKNPOBBN102

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    1210

  • Package Description:

    CHIP

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Mainland China, Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8532.24.00.20

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    YAGEO Corporation

  • YTEOL:

    7.69

  • Capacitance:

    0.001 µF

  • Capacitor Type:

    CERAMIC CAPACITOR

  • Dielectric Material:

    CERAMIC

  • Height:

    1.25 mm

  • JESD-609 Code:

    e3

  • Length:

    3.2 mm

  • Mounting Feature:

    SURFACE MOUNT

  • Multilayer:

    Yes

  • Negative Tolerance:

    5%

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Shape:

    RECTANGULAR PACKAGE

  • Package Style:

    SMT

  • Packing Method:

    TR, Blister, 7 Inch

  • Positive Tolerance:

    5%

  • Rated (DC) Voltage (URdc):

    500 V

  • Size Code:

    1210

  • Surface Mount:

    YES

  • Temperature Characteristics Code:

    C0G

  • Temperature Coefficient:

    30ppm/Cel ppm/°C

  • Terminal Finish:

    Matte Tin (Sn) - with Nickel (Ni) barrier

  • Terminal Shape:

    WRAPAROUND

  • Width:

    2.5 mm

CC1210JKNPOBBN102 Frequently Asked Questions (FAQs)

  • The recommended land pattern for CC1210JKNPOBBN102 is a rectangular pad with a size of 1.3mm x 1.3mm, with a non-solder mask defined (NSMD) pad shape. The pad should be centered on the component and have a solder mask clearance of 0.1mm.
  • Yes, CC1210JKNPOBBN102 is rated for operation up to 150°C, making it suitable for high-temperature applications. However, it's essential to ensure that the component is properly derated for temperature and power handling to prevent overheating and premature failure.
  • During PCB assembly, handle CC1210JKNPOBBN102 by the edges to prevent damage to the component. Avoid touching the component's surface, as the oils from human skin can cause damage to the ceramic material. Use ESD-safe handling procedures and tools to prevent electrostatic discharge damage.
  • CC1210JKNPOBBN102 is rated for operation in environments with relative humidity up to 85%. However, it's essential to ensure that the component is properly sealed and protected from moisture ingress to prevent degradation or failure.
  • The recommended soldering profile for CC1210JKNPOBBN102 is a peak temperature of 260°C, with a dwell time of 10-30 seconds. The soldering process should be done in a nitrogen atmosphere to prevent oxidation and ensure reliable joints.

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CC1210JKNPOBBN102 Overview

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Part Image CL32C102JGFGCNE Samsung Electro-Mechanics

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Part Image CL32C102JGFGLNB Samsung Electro-Mechanics

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For a full list of alternate parts for CC1210JKNPOBBN102, check out Findchips.com