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CD1408-F11000 - Bourns

Description: ■ Lead free device (RoHS compliant*) ■ Low profile ■ Low power loss, high efficiency ■ UL 94V-0 classification

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PCB Footprints
CD1408-F11000 - Bourns PCB footprint - Diodes Chip - Diodes Chip - CD1408
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CD1408-F11000 - Bourns  - 3D model - Diodes Chip - CD1408
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CD1408-F11000 Details

  • Manufacturer Part Number:

    CD1408-F11000

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SOD-123, SOD-87, 2 PIN

  • Pin Count:

    2

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Factory Lead Time:

    18 Weeks

  • Manufacturer:

    Bourns Inc

  • YTEOL:

    7

  • Additional Feature:

    FREE WHEELING DIODE, LOW POWER LOSS

  • Application:

    EFFICIENCY

  • Breakdown Voltage-Min:

    1000 V

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    1.3 V

  • JESD-30 Code:

    R-PDSO-N2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    30 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -65 °C

  • Output Current-Max:

    1 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Reference Standard:

    MIL-STD-750

  • Rep Pk Reverse Voltage-Max:

    1000 V

  • Reverse Current-Max:

    5 µA

  • Reverse Recovery Time-Max:

    0.3 µs

  • Reverse Test Voltage:

    1000 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    NO LEAD

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    10

CD1408-F11000 Frequently Asked Questions (FAQs)

  • Bourns provides a recommended PCB layout and land pattern in their application note AN164, which can be found on their website. It's essential to follow these guidelines to ensure proper thermal management and to prevent thermal-related issues.
  • The thermal pad on the CD1408-F11000 should be connected to a solid copper plane on the PCB to ensure efficient heat dissipation. A thermal via or a thermal pad connection to a heat sink can also be used. It's crucial to follow proper thermal management techniques to prevent overheating.
  • Although the datasheet specifies an operating temperature range of -40°C to 125°C, it's essential to consider the derating curves and thermal management guidelines to ensure the device operates within a safe temperature range. Typically, a maximum operating temperature of 100°C is recommended.
  • Yes, the CD1408-F11000 is designed to withstand high-vibration environments. However, it's crucial to follow proper mounting and soldering techniques to ensure the device is securely attached to the PCB. Additionally, consider using a vibration-resistant mounting method, such as a screw-down or adhesive mounting, to prevent the device from detaching during operation.
  • The CD1408-F11000 meets various safety and regulatory standards, including UL, ENEC, and IEC. To ensure compliance, follow the guidelines and recommendations provided in the datasheet and application notes. Additionally, consult with a qualified safety engineer or regulatory expert to ensure the device meets the specific requirements of your application.

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CD1408-F11000 Overview

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