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CD214A-S1M - Bourns

Description: Diode 1000 V 1A Surface Mount 2-SMD

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Symbol
CD214A-S1M - Bourns - PCB symbol
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PCB Footprints
CD214A-S1M - Bourns PCB footprint - Diodes Chip - Diodes Chip - CD214A-S1
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3D Models
CD214A-S1M - Bourns - 3D model - Diodes Chip - CD214A-S1
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CD214A-S1M Details

  • Manufacturer Part Number:

    CD214A-S1M

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Factory Lead Time:

    20 Weeks

  • Date Of Intro:

    2020-01-22

  • Manufacturer:

    Bourns Inc

  • YTEOL:

    7

  • Additional Feature:

    LOW POWER LOSS

  • Application:

    EFFICIENCY

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    1 V

  • JESD-30 Code:

    R-PDSO-N2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    30 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -65 °C

  • Output Current-Max:

    1 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Rep Pk Reverse Voltage-Max:

    1000 V

  • Reverse Current-Max:

    5 µA

  • Reverse Test Voltage:

    1000 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    NO LEAD

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

CD214A-S1M Frequently Asked Questions (FAQs)

  • Bourns recommends a symmetrical PCB layout with a solid ground plane to minimize electromagnetic interference (EMI) and ensure optimal performance. A minimum of 2 oz copper thickness is recommended for the PCB.
  • While the CD214A-S1M is rated for operation up to 125°C, it's essential to consider the derating curves and thermal management to ensure reliable operation. Consult with Bourns' application engineers for specific guidance on high-temperature applications.
  • Follow the recommended soldering profile and use a solder with a melting point above 217°C to ensure reliable connections. Avoid excessive soldering temperatures and times to prevent damage to the component.
  • Store the CD214A-S1M in its original packaging or a similar ESD-protective container to prevent damage from electrostatic discharge. Handle the component by the body, avoiding touching the leads or electrical contacts.
  • While the CD214A-S1M is designed to withstand normal vibration and shock, it's essential to consider the specific environmental conditions and consult with Bourns' application engineers for guidance on ensuring reliable operation in high-vibration or shock-prone environments.

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CD214A-S1M Overview

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