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CD214B-S3G - Bourns

Description: BOURNS - CD214B-S3G - Standard Recovery Diode, 400 V, 3 A, Single, 1 V, 96 A

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Symbol
CD214B-S3G - Bourns - PCB symbol
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PCB Footprints
CD214B-S3G - Bourns PCB footprint - Other - Other - SMB/DO-214AA(H=1.35mm)
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3D Models
CD214B-S3G - Bourns - 3D model - Other - SMB/DO-214AA(H=1.35mm)
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CD214B-S3G Details

  • Manufacturer Part Number:

    CD214B-S3G

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Factory Lead Time:

    20 Weeks

  • Date Of Intro:

    2020-01-22

  • Manufacturer:

    Bourns Inc

  • YTEOL:

    6.45

  • Application:

    EFFICIENCY

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    1 V

  • JESD-30 Code:

    R-PDSO-N2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    96 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -65 °C

  • Output Current-Max:

    3 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Rep Pk Reverse Voltage-Max:

    400 V

  • Reverse Current-Max:

    5 µA

  • Reverse Test Voltage:

    400 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    NO LEAD

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

CD214B-S3G Frequently Asked Questions (FAQs)

  • Bourns provides a recommended PCB pad layout in their application note AN-1142, which includes a downloadable layout template.
  • Bourns recommends using a thermal pad on the bottom of the device, and ensuring good thermal conductivity between the device and the PCB. A thermal interface material (TIM) can be used to improve heat transfer.
  • The CD214B-S3G has an operating temperature range of -40°C to +125°C, with a maximum junction temperature (TJ) of 150°C.
  • Yes, the CD214B-S3G is qualified to AEC-Q200 and is suitable for use in high-reliability and aerospace applications. However, additional testing and validation may be required for specific applications.
  • Bourns recommends a reflow soldering profile with a peak temperature of 260°C, and a dwell time above 220°C of 20-30 seconds. A detailed reflow profile can be found in the Bourns application note AN-1142.

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CD214B-S3G Overview

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