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CDBA3200-HF - Comchip Technology

Description: Schottky Diodes

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CDBA3200-HF - Comchip Technology PCB footprint - Diodes Moulded - Diodes Moulded - DO-214AC (SMA
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CDBA3200-HF - Comchip Technology  - 3D model - Diodes Moulded - DO-214AC (SMA
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CDBA3200-HF Details

  • Manufacturer Part Number:

    CDBA3200-HF

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Not Recommended

  • Package Description:

    SMA, 2 PIN

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Manufacturer:

    Comchip Technology Corporation Ltd

  • YTEOL:

    3

  • Additional Feature:

    LOW POWER LOSS

  • Application:

    EFFICIENCY

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    0.9 V

  • JEDEC-95 Code:

    DO-214AC

  • JESD-30 Code:

    R-PDSO-C2

  • Non-rep Pk Forward Current-Max:

    70 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -50 °C

  • Output Current-Max:

    3 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Rep Pk Reverse Voltage-Max:

    200 V

  • Reverse Current-Max:

    500 µA

  • Reverse Test Voltage:

    200 V

  • Surface Mount:

    YES

  • Technology:

    SCHOTTKY

  • Terminal Form:

    C BEND

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    10

CDBA3200-HF Frequently Asked Questions (FAQs)

  • A 1-10uF ceramic capacitor (X5R or X7R dielectric) is recommended for input decoupling, placed as close to the VIN pin as possible.
  • Use a minimum output capacitor of 2.2uF (X5R or X7R dielectric) with an ESR of 0.1-10 ohms, and ensure the output capacitor is placed close to the VOUT pin.
  • The maximum allowed voltage drop is 2.5V, but it's recommended to keep it below 1.5V for optimal performance and to prevent overheating.
  • The CDBA3200-HF is rated for operation up to 125°C, but thermal derating is required above 85°C. Ensure proper heat sinking and thermal management to prevent overheating.
  • Use the formula: Pd = (VIN - VOUT) x IOUT. Calculate the junction temperature using the thermal resistance (RθJA) and power dissipation: Tj = TAMB + (RθJA x Pd).

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CDBA3200-HF Overview

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