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CDBM1100-G - Comchip Technology

Description: COMCHIP TECHNOLOGY CDBM1100-G, SMT Schottky Diode, 100V 1A, 2-Pin SOD-123 (Mini SMA)

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CDBM1100-G - Comchip Technology PCB footprint - Other - Other - CDBM1100-G-4
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CDBM1100-G Details

  • Manufacturer Part Number:

    CDBM1100-G

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    SOD-123, SMA, 2 PIN

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Manufacturer:

    Comchip Technology Corporation Ltd

  • YTEOL:

    0

  • Additional Feature:

    LOW POWER LOSS

  • Application:

    EFFICIENCY

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    0.85 V

  • JESD-30 Code:

    R-PDSO-F2

  • JESD-609 Code:

    e3

  • Non-rep Pk Forward Current-Max:

    30 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Current-Max:

    1 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Reference Standard:

    MIL-STD-750

  • Rep Pk Reverse Voltage-Max:

    100 V

  • Reverse Current-Max:

    500 µA

  • Reverse Test Voltage:

    100 V

  • Surface Mount:

    YES

  • Technology:

    SCHOTTKY

  • Terminal Finish:

    TIN

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    10

CDBM1100-G Frequently Asked Questions (FAQs)

  • The recommended soldering temperature profile for the CDBM1100-G is 250°C for 3-5 seconds, with a peak temperature of 260°C for 1-2 seconds.
  • While the CDBM1100-G is suitable for general-purpose rectification, it's not recommended for high-frequency applications (>1 kHz) due to its relatively high capacitance and inductance.
  • To ensure proper heat-sinking, use a thermal interface material (TIM) and attach the device to a heat sink with a thermal conductivity of at least 1 W/m-K. Ensure the heat sink is designed for the device's power dissipation.
  • The maximum allowable voltage transient for the CDBM1100-G is 1.5 times the rated voltage (1100V) for a duration of 10 ms or less.
  • Yes, the CDBM1100-G can be used in parallel or series configurations, but ensure proper current sharing and voltage balancing to prevent overheating and uneven stress.

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CDBM1100-G Overview

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