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CDBMT260-HF - Comchip Technology

Description: Schottky Diodes & Rectifiers Schottky 2A 60V

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Symbol
CDBMT260-HF - Comchip Technology - PCB symbol
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PCB Footprints
CDBMT260-HF - Comchip Technology PCB footprint - Small Outline Diode Flat Lead - Small Outline Diode Flat Lead - SOD-123H
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3D Models
CDBMT260-HF - Comchip Technology - 3D model - Small Outline Diode Flat Lead - SOD-123H
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CDBMT260-HF Details

  • Manufacturer Part Number:

    CDBMT260-HF

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Not Recommended

  • Package Description:

    SMA, 2 PIN

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Manufacturer:

    Comchip Technology Corporation Ltd

  • YTEOL:

    3

  • Additional Feature:

    LOW POWER LOSS

  • Application:

    EFFICIENCY

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    0.7 V

  • JESD-30 Code:

    R-PDSO-F2

  • Non-rep Pk Forward Current-Max:

    50 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Current-Max:

    2 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Reference Standard:

    MIL-19500

  • Rep Pk Reverse Voltage-Max:

    60 V

  • Reverse Current-Max:

    500 µA

  • Surface Mount:

    YES

  • Technology:

    SCHOTTKY

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    10

CDBMT260-HF Frequently Asked Questions (FAQs)

  • A thermal pad on the bottom of the package should be connected to a large copper area on the PCB to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended.
  • Ensure that the device is operated within the recommended voltage and current ratings, and that the PCB is designed to minimize thermal resistance. Also, consider using a thermal interface material to improve heat transfer.
  • Handle the device with ESD-protective materials, such as wrist straps, mats, and bags. Store the device in a dry, ESD-protected environment, and avoid touching the pins or leads.
  • Yes, but additional testing and qualification may be required. Consult with Comchip Technology Corporation Ltd for specific requirements and support.
  • Consult the datasheet and application notes for troubleshooting guidelines. If issues persist, contact Comchip Technology Corporation Ltd's technical support for assistance.

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CDBMT260-HF Overview

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