CDMC6D28NP-4R7MC footprint, schematic symbol and 3D model by Sumida

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CDMC6D28NP-4R7MC Details

The recommended PCB land pattern for the CDMC6D28NP-4R7MC is a rectangular pad with a size of 3.5mm x 2.5mm, with a 0.5mm spacing between pads.
The CDMC6D28NP-4R7MC is a lead-free component and can be soldered using a standard reflow soldering process. For rework, use a soldering iron with a temperature of 350°C to 370°C, and avoid applying excessive force or heat to prevent damage to the component.
The operating temperature range for the CDMC6D28NP-4R7MC is -40°C to 125°C, with a storage temperature range of -40°C to 150°C.
To ensure the reliability of the CDMC6D28NP-4R7MC in high-vibration applications, use a secure mounting method such as soldering or adhesive bonding, and consider using a vibration-dampening material such as a silicone adhesive or a vibration-absorbing pad.
The CDMC6D28NP-4R7MC is rated for a maximum current of 4.7A, so it is suitable for high-current applications. However, be sure to follow proper thermal management and PCB design guidelines to prevent overheating and ensure reliable operation.

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