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CDRH4D18NP-2R2NC - Sumida

Description: Fixed Inductors 2.2uH 1.32A 30% SMD LP INDUCTOR

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CDRH4D18NP-2R2NC - Sumida PCB footprint - Other - Other - CDRH4D18NP-100NC-2
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CDRH4D18NP-2R2NC Details

  • Manufacturer Part Number:

    CDRH4D18NP-2R2NC

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP, 2020, HALOGEN FREE AND ROHS COMPLIANT

  • Reach Compliance Code:

    Unknown

  • ECCN Code:

    EAR99

  • HTS Code:

    8504.50.80.00

  • Factory Lead Time:

    37 Weeks, 1 Day

  • Manufacturer:

    Sumida Corporation

  • YTEOL:

    7.4

  • Case/Size Code:

    2020

  • Construction:

    Magnetically Shielded

  • Core Material:

    FERRITE

  • DC Resistance:

    0.075 Ω

  • Inductance-Nom (L):

    2.2 µH

  • Inductor Application:

    POWER INDUCTOR

  • Inductor Type:

    GENERAL PURPOSE INDUCTOR

  • Number of Functions:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    100 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Height:

    2 mm

  • Package Length:

    4.7 mm

  • Package Style:

    SMT

  • Package Width:

    4.7 mm

  • Packing Method:

    TR

  • Rated Current-Max:

    1.32 A

  • Shape/Size Description:

    RECTANGULAR PACKAGE

  • Shielded:

    YES

  • Surface Mount:

    YES

  • Terminal Placement:

    DUAL ENDED

  • Terminal Shape:

    WRAPAROUND

  • Test Frequency:

    7.96 MHz

  • Tolerance:

    30%

CDRH4D18NP-2R2NC Frequently Asked Questions (FAQs)

  • The recommended land pattern for the CDRH4D18NP-2R2NC is a rectangular pad with a size of 3.5mm x 2.5mm, with a non-solder mask defined (NSMD) pad shape. The pad should be centered on the component and have a solder mask opening of 2.5mm x 1.5mm.
  • The CDRH4D18NP-2R2NC has a maximum operating temperature of 125°C. To ensure reliable operation, it's essential to provide adequate thermal relief through proper PCB design, component placement, and heat dissipation mechanisms. A thermal via or thermal pad can be used to dissipate heat away from the component.
  • The recommended soldering profile for the CDRH4D18NP-2R2NC is a reflow soldering process with a peak temperature of 260°C, a dwell time of 30-60 seconds, and a ramp-up rate of 3°C/second. It's essential to follow the manufacturer's recommended soldering profile to ensure reliable assembly and minimize the risk of component damage.
  • The CDRH4D18NP-2R2NC is designed to withstand moderate vibration levels. However, for high-vibration environments, it's recommended to use additional mechanical support or potting to ensure the component remains securely in place. Consult with the manufacturer or a qualified engineer to determine the suitability of the component for your specific application.
  • The CDRH4D18NP-2R2NC meets various safety and regulatory standards, including UL, IEC, and RoHS. However, it's essential to review the component's certifications and compliance with your specific application's requirements. Consult with the manufacturer or a qualified engineer to ensure the component meets your application's safety and regulatory requirements.

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CDRH4D18NP-2R2NC Overview

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