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CE201210-33NJ - Bourns

Description: BOURNS - CE201210-33NJ - 高频电感器, 33 nH, CE201210 Series, 300 mA, 0805 [2012 公制], 多层, 0.6 ohm

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PCB Footprints
CE201210-33NJ - Bourns PCB footprint - Inductors Chip - Inductors Chip - CE201210
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CE201210-33NJ - Bourns  - 3D model - Inductors Chip - CE201210
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CE201210-33NJ Details

  • Manufacturer Part Number:

    CE201210-33NJ

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Not Recommended

  • Package Description:

    CHIP

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8504.50.80.00

  • Factory Lead Time:

    14 Weeks

  • Manufacturer:

    Bourns Inc

  • YTEOL:

    3

  • Case/Size Code:

    0805

  • Construction:

    Rectangular

  • Core Material:

    CERAMIC

  • DC Resistance:

    0.6 Ω

  • Inductance-Nom (L):

    0.033 µH

  • Inductor Application:

    RF INDUCTOR

  • Inductor Type:

    GENERAL PURPOSE INDUCTOR

  • JESD-609 Code:

    e2

  • Number of Functions:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Height:

    0.83 mm

  • Package Length:

    2 mm

  • Package Style:

    SMT

  • Package Width:

    1.25 mm

  • Packing Method:

    TR, 7 Inch

  • Rated Current-Max:

    0.3 A

  • Self Resonance Frequency:

    1200 MHz

  • Shape/Size Description:

    RECTANGULAR PACKAGE

  • Shielded:

    NO

  • Surface Mount:

    YES

  • Terminal Finish:

    SILVER NICKEL TIN

  • Terminal Placement:

    DUAL ENDED

  • Terminal Shape:

    WRAPAROUND

  • Test Frequency:

    100 MHz

  • Tolerance:

    5%

CE201210-33NJ Frequently Asked Questions (FAQs)

  • Bourns recommends a symmetrical PCB layout with a solid ground plane to minimize electromagnetic interference (EMI) and ensure optimal performance. A minimum of 2 oz copper thickness is recommended for the PCB.
  • The CE201210-33NJ has a maximum operating temperature of 125°C. Ensure proper airflow and thermal management in your design to prevent overheating. You can also consider using a heat sink or thermal interface material to improve heat dissipation.
  • Bourns recommends a soldering profile with a peak temperature of 260°C (500°F) for a maximum of 10 seconds. A slower ramp-up and ramp-down rate can help prevent thermal shock and ensure reliable solder joints.
  • The CE201210-33NJ is designed to withstand moderate vibration levels. However, if your application involves extreme vibration, you may need to consider additional mechanical support or a more ruggedized inductor design. Consult with Bourns or a qualified engineer for specific guidance.
  • To minimize magnetic radiation and ensure proper shielding, keep the inductor at least 5 mm away from other components and use a shielded enclosure or a mu-metal shield around the inductor. You can also consider using a shielded inductor or a different inductor design with built-in shielding.

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CE201210-33NJ Overview

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