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CE201210-8N2J - Bourns

Description: Fixed Inductors 8.2nH 5% .85mm Multi Layer

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PCB Footprints
CE201210-8N2J - Bourns PCB footprint - Inductors Chip - Inductors Chip - 8N2J
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CE201210-8N2J - Bourns  - 3D model - Inductors Chip - 8N2J
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CE201210-8N2J Details

  • Manufacturer Part Number:

    CE201210-8N2J

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Not Recommended

  • Package Description:

    CHIP

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8504.50.80.00

  • Factory Lead Time:

    14 Weeks

  • Manufacturer:

    Bourns Inc

  • YTEOL:

    3

  • Case/Size Code:

    0805

  • Construction:

    Rectangular

  • Core Material:

    CERAMIC

  • DC Resistance:

    0.28 Ω

  • Inductance-Nom (L):

    0.0082 µH

  • Inductor Application:

    RF INDUCTOR

  • Inductor Type:

    GENERAL PURPOSE INDUCTOR

  • JESD-609 Code:

    e2

  • Number of Functions:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Height:

    0.83 mm

  • Package Length:

    2 mm

  • Package Style:

    SMT

  • Package Width:

    1.25 mm

  • Packing Method:

    TR, 7 Inch

  • Rated Current-Max:

    0.3 A

  • Self Resonance Frequency:

    2400 MHz

  • Shape/Size Description:

    RECTANGULAR PACKAGE

  • Shielded:

    NO

  • Surface Mount:

    YES

  • Terminal Finish:

    SILVER NICKEL TIN

  • Terminal Placement:

    DUAL ENDED

  • Terminal Shape:

    WRAPAROUND

  • Test Frequency:

    100 MHz

  • Tolerance:

    5%

CE201210-8N2J Frequently Asked Questions (FAQs)

  • Bourns provides a recommended PCB layout and land pattern in their application notes (AN16) and on their website. It's essential to follow these guidelines to ensure proper thermal management, reduce electromagnetic interference (EMI), and optimize the overall performance of the component.
  • The CE201210-8N2J has a high power rating, and proper thermal management is crucial. Ensure good airflow around the component, use a heat sink if necessary, and follow the recommended PCB layout and land pattern to minimize thermal resistance. Additionally, consider using thermal interface materials (TIMs) to improve heat transfer between the component and the heat sink.
  • Bourns recommends using a soldering iron with a temperature range of 250°C to 260°C and a solder with a melting point of 180°C to 190°C. Use a soldering technique that minimizes the thermal stress on the component, and avoid using excessive solder or flux. Follow the IPC-A-610 standard for electronic assembly and soldering.
  • To ensure reliability and longevity, follow proper storage and handling procedures, avoid exposing the component to extreme temperatures, humidity, or physical stress. Implement proper EMI shielding, and consider using conformal coatings or potting compounds to protect the component from environmental factors. Additionally, follow Bourns' recommended operating conditions and derating guidelines.
  • The CE201210-8N2J has built-in ESD protection, but it's still essential to follow proper ESD handling and storage procedures to prevent damage. For EMI protection, follow Bourns' recommended PCB layout and shielding guidelines, and consider using additional EMI filtering components if necessary.

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CE201210-8N2J Overview

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