CES-0402MC footprint, schematic symbol and 3D model by Nidec Copal

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CES-0402MC Details

The recommended land pattern for the CES-0402MC is a rectangular pad with a size of 0.5mm x 0.5mm, with a solder mask clearance of 0.1mm.
Yes, the CES-0402MC is rated for operation up to 125°C, making it suitable for high-temperature applications. However, the operating temperature range should be derated according to the specific application requirements.
The maximum allowable voltage for the CES-0402MC is 50V, as specified in the datasheet. Exceeding this voltage may damage the component.
For reflow soldering, the CES-0402MC should be placed on a solder paste layer with a thickness of 0.1mm to 0.2mm. The recommended reflow profile is 220°C to 240°C for 30 seconds to 60 seconds.
Yes, the CES-0402MC is compatible with lead-free soldering. However, the recommended reflow profile may vary depending on the specific lead-free solder alloy used.

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