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CFB600-48S12 - Cincon

Description: Isolated DC/DC Converters DC-DC Converter, Full Brick, 600 Watt, 2:1 Input Range, 36-75VDC Input, 12VDC Output

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PCB Footprints
CFB600-48S12 - Cincon PCB footprint - Other - Other - CFB600-48S12-3
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3D Models
CFB600-48S12 - Cincon  - 3D model - Other - CFB600-48S12-3
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CFB600-48S12 Details

  • Manufacturer Part Number:

    CFB600-48S12

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    FULL BRICK PACKAGE-16

  • ECCN Code:

    EAR99

  • Manufacturer:

    Cincon Electronics Corporation

  • YTEOL:

    7

  • Analog IC - Other Type:

    DC-DC REGULATED POWER SUPPLY MODULE

  • Approvals:

    IEC, EN, UL

  • Efficiency (Main Output):

    90%

  • Input Voltage-Max:

    75 V

  • Input Voltage-Min:

    36 V

  • Input Voltage-Nom:

    48 V

  • JESD-30 Code:

    R-PXMA-P16

  • Length:

    116.8 mm

  • Line Regulation-Max:

    0.2%

  • Load Regulation-Max:

    0.5%

  • Number of Functions:

    1

  • Number of Outputs:

    1

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    100 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current-Max:

    50 A

  • Output Voltage-Max:

    25.2 V

  • Output Voltage-Min:

    4.8 V

  • Output Voltage-Nom:

    12 V

  • Package Body Material:

    PLASTIC

  • Package Code:

    XMA

  • Package Shape:

    RECTANGULAR

  • Package Style:

    MICROELECTRONIC ASSEMBLY

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Protections:

    OVER CURRENT, OVER VOLTAGE, UNDER VOLTAGE, SHORT CIRCUI, OVER TEMP

  • Ripple Voltage (Main Out):

    0.04242 Vrms

  • Screening Level:

    IEC/EN/UL 62368-1

  • Seated Height-Max:

    13.2 mm

  • Surface Mount:

    NO

  • Technology:

    HYBRID

  • Terminal Form:

    PIN/PEG

  • Terminal Position:

    UNSPECIFIED

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Total Power Output-Max:

    600 W

  • Trim/Adjustable Output:

    YES

  • Warm-up Time:

    0.16 s

  • Width:

    61 mm

CFB600-48S12 Frequently Asked Questions (FAQs)

  • The recommended PCB layout should ensure good thermal conductivity and minimal thermal resistance. A multi-layer PCB with thermal vias and a heat sink on the top and bottom sides of the module can help to dissipate heat effectively. Additionally, a thermal interface material (TIM) can be used to fill the gap between the module and the heat sink.
  • To ensure reliability and longevity, it's essential to operate the module within the recommended temperature range and follow proper thermal management practices. Additionally, consider using conformal coating, potting, or encapsulation to protect the module from moisture and contaminants. Regular cleaning and maintenance can also help to prevent failures.
  • The CFB600-48S12 module is designed to meet CISPR 22 Class B and FCC Part 15 Class B emissions standards. To minimize EMI and RFI, ensure proper PCB layout, use shielding, and follow good design practices for signal routing and grounding. Additionally, consider using EMI filters or common-mode chokes to reduce emissions.
  • Yes, the CFB600-48S12 module can be used in redundant or parallel configurations to achieve higher power ratings or improve system reliability. However, it's essential to ensure proper synchronization and control of the modules to prevent oscillations or instability. Consult with Cincon Electronics Corporation or a qualified engineer for specific guidance on implementing redundant or parallel configurations.
  • The CFB600-48S12 module meets various safety certifications, including UL, cUL, and CE. Ensure proper installation, operation, and maintenance of the module to prevent electrical shock, fire, or other hazards. Follow the recommended safety guidelines and precautions outlined in the datasheet and user manual.

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CFB600-48S12 Overview

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