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CFM25S120 - Cincon

Description: Switching Power Supplies AC-DC Power Supply, Open Frame, 25 Watt, Single Output, 12VDC Output, 2.1A, 84% Efficiency, PCB

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PCB Footprints
CFM25S120 - Cincon PCB footprint - Other - Other - CFM25S120
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3D Models
CFM25S120 - Cincon  - 3D model - Other - CFM25S120
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CFM25S120 Details

  • Manufacturer Part Number:

    CFM25S120

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    PACKAGE-4

  • ECCN Code:

    EAR99

  • Manufacturer:

    Cincon Electronics Corporation

  • YTEOL:

    7

  • Analog IC - Other Type:

    AC-DC REGULATED POWER SUPPLY MODULE

  • Approvals:

    CE, C-UL-US, EN, FCC, IEC, TUV, UKCA, UL

  • Efficiency (Main Output):

    84%

  • Input Voltage-Max:

    264 V

  • Input Voltage-Min:

    90 V

  • Input Voltage-Nom:

    100 V

  • JESD-30 Code:

    R-XDMA-P4

  • Length:

    50.8 mm

  • Line Regulation-Max:

    1%

  • Load Regulation-Max:

    1%

  • Number of Functions:

    1

  • Number of Outputs:

    1

  • Number of Terminals:

    4

  • Operating Temperature-Max:

    70 °C

  • Operating Temperature-Min:

    -30 °C

  • Output Current-Max:

    2.1 A

  • Output Voltage-Max:

    12.12 V

  • Output Voltage-Min:

    11.88 V

  • Output Voltage-Nom:

    12 V

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    DMA

  • Package Equivalence Code:

    MODULE,4LEAD,1.8

  • Package Shape:

    RECTANGULAR

  • Package Style:

    MICROELECTRONIC ASSEMBLY

  • Protections:

    OVER VOLTAGE, SHORT CIRCUIT

  • Ripple Voltage (Main Out):

    0.042 Vrms

  • Screening Level:

    EN/IEC/UL 62368-1

  • Seated Height-Max:

    24.9 mm

  • Surface Mount:

    NO

  • Technology:

    HYBRID

  • Terminal Form:

    PIN/PEG

  • Terminal Position:

    DUAL

  • Total Power Output-Max:

    25 W

  • Trim/Adjustable Output:

    NO

  • Width:

    27.94 mm

CFM25S120 Frequently Asked Questions (FAQs)

  • The recommended PCB layout for optimal thermal performance involves placing the CFM25S120 near a thermal pad or a heat sink, and ensuring good airflow around the component. A minimum of 1 oz copper thickness and a 2-layer PCB is recommended.
  • To ensure reliable operation at high temperatures, it is essential to follow the recommended derating curves, ensure good thermal management, and avoid exceeding the maximum junction temperature of 150°C.
  • The CFM25S120 is an electrostatic-sensitive device. Handle it with anti-static wrist straps, mats, or bags, and store it in a dry, cool place away from direct sunlight.
  • While the CFM25S120 is designed to operate in a wide range of temperatures, it is not recommended for use in high-humidity environments (>80% RH) without proper moisture protection, such as conformal coating or potting.
  • The recommended soldering profile for the CFM25S120 involves a peak temperature of 260°C, with a dwell time of 10-30 seconds above 220°C. Avoid exceeding 280°C to prevent damage to the component.

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CFM25S120 Overview

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