The recommended land pattern for CFN0805-FX-R005ELF is a rectangular pad with a size of 0.8mm x 1.2mm, with a non-solder mask defined (NSMD) pad shape. This ensures proper soldering and minimizes the risk of solder bridging.
While CFN0805-FX-R005ELF is rated for operation up to 125°C, it's essential to consider the specific application's temperature profile and potential thermal stresses. Bourns recommends consulting their application notes and performing thermal simulations to ensure the component's reliability in high-temperature environments.
CFN0805-FX-R005ELF is a moisture-sensitive device (MSD). To prevent damage, it's crucial to follow proper handling and storage procedures, such as storing the components in a dry, nitrogen-filled environment, and using a moisture barrier bag or desiccant packet. Always follow the recommended MSL (Moisture Sensitivity Level) guidelines.
Bourns recommends a soldering profile with a peak temperature of 260°C, a dwell time of 10-30 seconds, and a ramp rate of 3°C/second. This profile ensures proper solder wetting and minimizes the risk of component damage or thermal shock.
Yes, CFN0805-FX-R005ELF is compatible with lead-free soldering processes. However, it's essential to follow the recommended soldering profile and ensure that the soldering process is optimized for the specific lead-free solder alloy being used.
Trust Checks
This model has been provided by an expert contributor.
Expert Contribution
This model has been verified by system checks.
System Verified
This model has been reviewed by community users.
Community Approved
Sponsored
CFN0805-FX-R005ELF Overview
Use the download button to access the CFN0805-FX-R005ELF schematic symbol and PCB footprint.
To find more CAD model downloads similar to this part, try a partial part number search, like CFN08,
or try a keyword search, such as Metal Foil Resistors
Suggested Parts
If you searched for CFN0805-FX-R005ELF, you might also be interested in these parts:
